Industry Workshops

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Larry Hawkins
Richardson RFPD
205/207
Abstract

mmWave is the new frontier in RF design. There are many advantages of working at these frequencies and more opportunity as more bands are opened for different applications. There are also many difficulties, especially for those that do not have a lot of experience.
Richardson RFPD has made available a 24-44 GHz up-down converter design accelerator to help alleviate some of those difficulties. It can be used as to help demonstrate a concept to your customer, to start your algorithm development, or as a reference design. The workshops goal is to demonstrate and to show its applications.

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David Vye
Cadence
205/207
Abstract

Advances in front-end RFIC electronics and highly integrated RF PCB designs are making it possible to adopt phased-array systems for commercial mmWave applications. This workshop explores recent developments in mmWave technology from the perspective of EM simulation, in-situ circuit simulation, phased-array synthesis, and RF PCB design. The system requirements that drive antenna/front-end architectural decisions for mmWave applications, antenna optimization, and array configuration and generation will be discussed and the use of RF system design software for link budget analysis will be demonstrated.

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Michael Foegelle, Dennis Lewis, Lawrence Moore
ETS-Lindgren, Boeing, Ericsson
205/207
Abstract

5G and emerging wireless technologies are being considered in a wide range of spectrum bands to support a significantly increased user density. With the industry’s adoption of multi-user MIMO, massive MIMO, and mmWave in emerging wireless systems, several worldwide industries and standards bodies face new measurement challenges in NR OTA testing to verify products meet intended performance parameters demanded by diverse technological requirements. Applications in diverse environments, such as commercial aircraft and base stations, will be reviewed. Experts and active contributors to the 5G wireless industry standards committees will review these challenges and propose novel solutions.

David Daughton, Suren Singh, Nizar Messaoudi
Lake Shore Cryotronics, Keysight Technologies
403/404
Abstract

2-port S-parameter characterization of wafer-level devices at cryogenic temperatures has a relatively long history; however, there has been considerably less work on differential/mixed-mode S-parameter characterization in these environments. With the emergence of cryogenic temperature microwave systems for quantum computing, there is increasing interest in high frequency integrated circuit design with differential signaling for cold environments. Here we will discuss the instrumentation, probes, calibrations, and environmental consideration for wafer-level characterization of differential devices at cryogenic temperatures and magnetic fields.

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Nizar Messaoudi, Jack DeGrave
Keysight Technologies, FormFactor
205/207
Abstract

Until recently, quantum engineers operating devices at milli-Kelvin temperatures are faced with the difficulties and inconveniences of long development cycles. The major bottlenecks include time-consuming wire bonding, expensive packaging processes prior to device cooldown, and long cooldown times for dilution refrigerators. This workshop presents an integrated measurement solution for Pre-Screening qubit devices, allowing quantum engineers to eliminate wire-bonding and packaging from cryogenic test processes and to provide critical qubit performance parameters at 50 mK, thus streamlining device deployment, and reducing the time for development cycles.

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Gavin Fisher
FormFactor
205/207
Abstract

We will highlight the best methods for setting up, calibrating, and evaluating measurement performance in coaxial and waveguide bands spanning WR15 (75 GHz) to WR1 (1100 GHz) over a broad (-40 to 125c) temperature range
A novel out single sweep measurement from 900 Hz to 220 GHz will be shown along with detailed complete automation of these measurements
Hany programming examples using WinCalXE software will be demonstrated automating data measurement and analysis for on wafer measurements. We also evaluate system stability and performance.
A very conventient approach is discussed to allow safe and convenience band swaps and probe installation

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Michael Thompson, Ron Pongratz
Cadence
205/207
Abstract

The need to design and produce smaller, less expensive, and increasingly complex devices is the mantra of our industry. This has led to designs in smaller, more complex packages, smaller process nodes, and the use of multiple IC technologies, all within a shorter design cycle. This workshop will consider recent developments in EDA software that address the challenges of adopting advanced node silicon and heterogenous packaging technology for RF to mmWave applications.

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Gareth Lloyd, Diamond Liu, Salvatore Finocchiaro
Rohde & Schwarz, SynMatrix Technologies, QORVO, Inc.
205/207
Abstract

5G is here. The focus is on improving systems and enhancing capabilities. This drives the integration of components, extending bandwidth coverage per RF channel and improving energy efficiency. We will look at enhanced filter and amplifier design and testing. Load Modulated Balanced Amplifier (LMBA) structures offer typically Doherty levels of efficiency with increased bandwidth.
The workshop will provide an overview of the latest technologies and requirements of RF frontends. Experts from test and measurement and industry partners will provide solutions that meet demanding requirements and help to develop latest LMBA topologies using a measurement-aided approach.

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Larry Hawkins
Richardson RFPD
205/207
Abstract

We will demonstrate and discuss the BytePipe Toolbox for Matlab and Simulink which provides a set of tools for interfacing, modeling, and targeting designs using the BytePipe RF System on Module.
The device interfaces will provide control and data streaming using MATLAB System Objects and Simulink Blocks. The control interface allows for configuration of components included in the Software Development Kit. This includes support for configuration of the ADI ADRV9002 Agile Transceiver and Xilinx ZynqMP Baseband Processor functions. Individual settings can be configured independently or as a whole. Design support includes filter/profile wizards, and tools commonly used in modem design.

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Garth D'Abreu, Jason Coder, Jari Vikstedt, Lawrence Moore
ETS-Lindgren, NIST, Ericsson
205/207
Abstract

Achieving electromagnetic compatibility (EMC) for 5G devices is dependent upon the existence of achievable and appropriate regulatory requirements along with meaningful test methods for demonstrating compliance. This workshop will investigate new developments in test methods, focused on meeting the regulatory requirements of the FCC but with global application, with presentations focused on wireless coexistence and radiated emissions test methods. An overview of wireless coexistence measurements and challenges is presented followed by a focus on automotive applications. This is followed by an overview of emerging radiated emissions test methods and research on utilizing a reverberation methodology for faster TRP measurements.

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Malgorzata Celuch, Say Phommakesone, Marzena Olszewska-Placha, Urmi Ray, Nate Orloff, Lucas Enright
QWED Sp. z o.o., Keysight Technologies, iNEMI, NIST
205/207
Abstract

The Workshop discusses the iNEMI 5G benchmarking activity of materials’ characterization techniques relevant to 5G/mmWave applications. Four measurement methods (SCR, SPDR, BCDR, FPOR) have been identified and tested in a round-robin of 10 sample kits (including Precision Teflon, COP, and fused silica) circulated between 10 laboratories. The experimental results will be presented and the physics of the measurement process will be illustrated with FDTD, FEM, and MoM simulations. The Workshop comprises four 15 min lectures (5G industry needs; benchmarked methods and EM insight; round-robin results; best practices and recommendations) followed by 45 min hands-on excercises and 15 min discussion.