MicroApps Seminars

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Marzena Olszewska-Placha, Malgorzata Celuch, Janusz Rudnicki
QWED Sp. z o.o.
Show Floor Booth 9110
Abstract

We discuss recent extensions of the dielectric resonator (DR) method for electronic materials’ measurements to the 2D imaging of materials’ surfaces. We present new 10GHz scanners based on:
- Split-Post DR for high-resistivity materials,
- Single-Post DR for conductive surfaces.
We focus on:
- EM aspects of the scanner design, exploring new features of QuickWave EM software by QWED, version 2021 https://qwed.eu/v2021.html,
- applications to materials relevant to 5G (identified in iNEMI 5G-Project https://www.inemi.org/5g-mat-assessment), organic and inorganic semiconductors, and energy materials.
Our IMS Booth #7099 offers hands-on experience with:
- QuickWave EM design software,
- test-fixtures for microwave material measurements.

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Diamond Liu
Engineering
Show Floor Booth 9110
Abstract

This industry seminar will demonstrate the accelerated SynMatrix-Ansys HFSS workflow for 5G and mmWave microwave filter design. The MicroApps seminar will highlight the use of automation workflows to completely change the way a waveguide filter is 3D rendered, analyzed and optimized. The use case example will cover a rectangular waveguide seen in high frequency applications.

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Yoshiyuki Yanagimoto
EM Labs Inc
Show Floor Booth 9110
Abstract

Fabry-Perot Resonators are now available to measure dielectric constant and loss tangent of low loss materials up to 330-GHz. Measurement results of varieties of resins and ceramics, such as poly-imide, LCP, epoxy and Alumina will be presented as a trigger to an enthusiastic discussion. The unprecedented repeatability proved out a small anisotropy of resins down to 1% at 330GHz, which will be also presented. Simple operation and sophisticated measurement algorithm made it possible to take such data in two minutes per sample. Comparison data with other methods, such as Split Cylinder Resonators, and Free Space method will also be shown.

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Alexander Kaiser
Cicor Group
Show Floor Booth 9110
Abstract

For many applications, integration density and small form factor of circuits are essential. Our newly developed technology allows direct integration/embedding of thinned active ICs into thin film circuit boards. And thus, enables the manufacturing of very thin structures with short interconnection lengths. Together with the special benefits of thin film circuits (high resolution patterning, production processes adapted from semiconductor manufacturing, tight structural tolerances, use of noble metals as conductor, etc.), this technology provides a platform for distributed sensing and data processing, also in sophisticated applications.
Our contribution will focus on the technical realization and some application examples.

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Mo Hasanovic
Smiths Interconnect Inc.
Show Floor Booth 9110
Abstract

One of major drawbacks of active and passive RF devices is their performance dependence on temperature and frequency. Many RF amplifiers exhibit decreasing gain slope with increasing frequency - an issue magnified with cascaded amplifiers due to bandwidth roll-off in other components of the RF chain. These systems require frequency compensation of attenuation through rapid customizable approach and small-size component. Here, we are proposing a frequency equalizer, easy to configure for required frequency band/slope and without reactive lumped elements that increase the design complexity. The design is compatible to the standard manufacturing processes and provides robustness to the manufacturing tolerances.

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Markus Loerner
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

The new solution streamlines the development process of RF components and systems by allowing real signals to be used in EDA system simulation and hardware tests. Simulation with complex wideband signals according to latest 5G NR or Wi-Fi specifications allows more realistic results than before. Using the same signal creation methods and analysis algorithms as for subsequent hardware tests ensures a direct correlation from early design to implementation verification.
The R&S®VSESIM-VSS solution is enhancing the capabilities of the Cadence® Visual System Simulator™ (VSS), widely used to perform EDA simulation.

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Markus Loerner
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Although RF frontends are highly non-linear when they are operated close to saturation for best energy efficiency, the new method we are introducing gives insights into capabilities and improvement using linearization to enable low signal distortion of the complete RF chain. R&S®VSESIM-VSS supports signal creation and analysis according to the latest 5G and Wi-Fi specifications; combining realistic standard-compliant signal performance investigation with linearization from the R&S VSE Direct DPD method shows what is possible in terms of signal purity and EVM.

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Kudret Unal
Analog Devices, Inc.
Show Floor Booth 9110
Abstract

Ultra-low jitter clocks play a serious role in modern communication, instrumentation and radar applications to get best performance. On top of the requirement for an ultra-low jitter clock, synchronization of multiple high frequency clocks (especially fractional PLLs) is the other challenge for the large converter array applications. This work collects all these challenges and provides an exceptional solution which is very easy to adapt. EZSYNC and Timed-SYNC concepts of the new Fractional PLL chips give the option for selecting the most suitable synchronization method while providing the best-in-class jitter performance up to 12.8 GHz.

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Wolfgang Wendler
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

A new microwave measurement receiver calibrates signal generators and attenuators. Most important features provided are tuned RF level measurements, level measurements, analog modulation and spectrum analysis. Additionally, a powerful hardware for high end phase noise test is incorporated, with cross correlation for increased sensitivity and real-time demodulation showing amplitude and phase noise in parallel. It offers also digital and analog modulation analysis, 80 MHz analysis bandwidth, analysis of pulses and VOR/ILS signals. It is a single box instrument designed to reduce the complexity in calibration.

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Jenny Gallery
Indium Corporation
Show Floor Booth 9110
Abstract

80Au20Sn is a common solder material in semiconductor laser die-attach applications, due to temperature requirements that mandate the use of a high-melting solder. However, industry-wide adoption for semiconductor lasers has been limited due to the difficulty in managing thermal heat dissipation. The use of thinner 80Au20Sn preforms in the bondline is one solution to this, which will quickly and more efficiently transfer the heat to the heat sink. Defining the voiding percentages for several 80Au20Sn preform thicknesses, from 0.002” to 0.0035” thick, is crucial to draw conclusions on the effect of 80Au20Sn preform thickness on thermal transfer in semiconductor lasers.

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John Coonrod
Rogers Corporation
Show Floor Booth 9110
Abstract

The 3D printing industry has made many advances over the past several years, but until now, there was no option for 3D printing a structure with good RF properties with high resolution photopolymer printing processes like Digital Light Processing (DLP). Rogers Corporation introduced a new 3D printing material which has good RF properties. This capability opens possibilities for quick prototyping of RF concepts and the ability to generate 3D RF structures that are not possible with other fabrication technologies. This will be an introduction to this technology, with some examples shown.

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David Vye, Gus Dallman
Cadence
Show Floor Booth 9110
Abstract

Cadence® AWR Design Environment® V16 supports silicon and III-V semiconductor MMIC and RFIC design using Virtuoso® PDKs in AWR® Microwave Office® software. This presentation showcases Virtuoso PDK support in the AWR platform, providing designers using the latest RF silicon foundry processes access to PCells, synth code, iNets, connectivity checking, and nonlinear circuit simulation such as load pull, stability, and circuit envelope analyses with the APLAC® HB engine. The groundbreaking cross-platform workflow from AWR software into Virtuoso System Design Platform and Virtuoso RF Solution allows up to a 50% reduction in turnaround time for RFIC/MMIC development and heterogenous technology integration.

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Gavin Fisher
FormFactor
Show Floor Booth 9110
Abstract

Formfactor have shown previously our Autonomous RF Measurement assistant using LRRM Calibration. Autonomous RF is used to manage the entire test flow for thermal and ambient testing. This includes the full automated calibration, monitoring to prevent measurement drift, adjustment of probe spacing to account for growth and adjust probing geometries to deal with devices of different layout. In this talk we will discuss the use of this approach with regard to doing MLTRL calibrations with this approach instead both off and on wafer. We will also show interaction between WinCal, python and analytical approach to evaluate the calibration repeatability.

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Ralf Ihmels
Mician GmbH
Show Floor Booth 9110
Abstract

At 5G millimeter wave frequencies, low loss gap waveguides are challenging traditional technologies. They do not require conductive contact between pieces making up the waveguide body, instead, they consist of one ideally conducting plate facing another one, the latter featuring a "bed of nails" style periodic surface with metallic pins. Standard 3D-FEM requires a dense mesh to accurately model gap fields. Taking advantage of periodic pin arrangement, Mician µWave Wizard breaks the structure down to a single row of pins, simulates this row once using a fast 2D-FEM solver and then repetitively cascades until the entire structure has been simulated.

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David Vye
Cadence
Show Floor Booth 9110
Abstract

Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. With the recent integration of the Cadence® Celsius™ Thermal Solver within the AWR Design Environment® V16 platform, RF designers now have access to electrothermal analysis for monolithic microwave IC (MMIC)/RFIC, PCB, and module designs. This MicroApp will highlight how the Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office® circuit design software software to provide designers with thermal heat map visualization and operating temperature information.

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Dustin Kendig
Microsanj
Show Floor Booth 9110
Abstract

Microwave devices are being deployed in mission-critical applications ranging from 5G and Smart Grid networks, to automotive and defense electronics. Devices may also be required to operate in a challenging environment. High temperatures, hot spots and temperature spikes can have a major impact on reliability. Performance requirements are leading to shrinking geometries, new materials and more complex structures. Since high temperatures contribute to MTTF, it is essential that one have a thorough understanding of static and dynamic thermal performance. Fortunately, advancements in characterization techniques are making it easier to gain this understanding to ensure reliability while meeting challenging performance requirements.

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John Coonrod
Rogers Corporation
Show Floor Booth 9110
Abstract

Copper is the backbone of the PCB industry, not to mention, most technologies worldwide. However, the copper used to build PCB’s is typically a copper foil. Due to how copper foil is made and applied for laminate manufacturing and PCB fabrication, it can have many influences on the performance of RF and High Speed Digital (HSD) circuitry. This presentation will give an overview of how copper foil is made, roughness measurements and the impact of copper roughness on propagation delay, phase, and insertion loss. Additionally, differences in performance due to roughness as it impacts different RF structures, will be explained

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Craig Blanchette, Darby Davis
BAE Systems, Gel-Pak
Show Floor Booth 9110
Abstract

Given the global chip shortage that has plagued the microelectronics industry for the past two years, the need for novel handling and packaging technology has never been greater. This presentation will inform on the shortcomings of the most common chip scale assembly packaging processes and will show the best in class fixtures, methods, and packaging types available. Chip migration prevention by way of proper handling and migration detection via x-ray will be discussed. Thin devices in CT scan 3D CT Scans will assist with visualization of component migration in clipped waffle packs.

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Timo Jaeschke, Simon Kueppers, Jan Barowski, Lukas Piotrowsky
2pi-Labs GmbH, Ruhr Univ. Bochum
Timo Jaeschke
2pi-Labs GmbH
Show Floor Booth 9110
Abstract

A FMCW radar signal processing and calibration concept to allow complex (magnitude and phase) and vector network analyzer (VNA)-like S-parameter measurements with cost-effective wide-band FMCW radar sensors is presented. The utilized D-band radar sensor covers an ultra-wide 56 GHz (126 GHz– 182 GHz) sweep bandwidth, can be equipped with a standard WR-6.5 waveguide flange and achieves measurement-grade phase stability with a cascaded multi-phase-locked-loop (PLL) frequency traceable reference clock concept. 

To demonstrate the achieved system performance and the potential of this approach, material characterization measurements are presented and compared to conventional VNA measurement equipment with waveguide extenders.

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Jan Budroweit, Markus Gardill, Witold Kinsner, Mahjeda Ali
German Aerospace Center, Brandenburg Univ. of Technology, Univ. of Manitoba, IEEE
Show Floor Booth 9110
Abstract

The space sector has evolved rapidly over the past decades. Today, entirely new players, driven by commercial interest and supported by private investors such as SpaceX, Spire or OneWeb are well known to deliver the dominating number of new LEO satellite systems. But not only those well-known big players, but also a plethora of small and mid-size enterprises making good business in that new economical field emerged. This recent commercialization of is commonly referred to as “New Space”. One key aspect of the interest especially in LEO is cheaper access to space, with various developments of reusable and low-cost launches. This comes together with new design & manufacturing paradigms for satellite systems, moving the focus away from the ultra-reliable monolithic integrated large spacecraft to typically much smaller satellites, designed for mass production.

The IEEE Low-Earth-Orbit (LEO) Satellites & Systems is a project of the IEEE Future Directions Committee (FDC) that focuses on those recent developments.  IEEE LEO SatS envisions to consolidate various distributed satellite activities around the globe and provides a focus on technology, science, education and awareness. Primary goal is to increase cooperation in LEO Satellite and Systems between professionals in academia, industry and government. By addressing the advancing relevant technologies of LEO SatS, and to attract high-quality university and college students to IEEE through the collaboration with young and seasoned professionals the IEEE IMS MicroApps platform would be a great opportunity.

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David Daughton, Scott Yano, Andy Owen
Lake Shore Cryotronics, Keysight Technologies
Show Floor Booth 9110
Abstract

With limited access to the microwave fixturing within cryogenic environments, Automatic Fixture Removal (AFR) is a promising approach to improving measurement throughput for microwave characterization of cold devices. However, attenuating microwave cabling is often used in cryogenic environments to reduce heat load to the sample under investigation, and this cable attenuation limits the reliable bandwidth of a microwave measurement using AFR. Here we will discuss the balance of heat load and cable performance to optimize AFR measurements for one and two port characterization of cold devices such as transistors and amplifiers.

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Jari Vikstedt
ETS-Lindgren
Show Floor Booth 9110
Abstract

There are many choices of chamber and antenna or device under test (DUT) positioner available to accomplish the varied radiated emissions measurements required for both licensed and unlicensed wireless devices. The optimal choice for a particular measurement is determined by many factors including but not limited to the operating frequency, DUT antenna dimensions, and size of the DUT. This presentation will provide an overview of available options and recommendations on their application.

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Rich Pieciak
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

The proliferation of different Standards addressing high-speed digital design is necessitating new ways of assessing “channel” performance in both the frequency and time domains.
Lack of access to traditional interfaces requires new techniques to assess a devices’ intended performance, given the necessity of dense packaging and connectivity concerns, driven by ever-increasing data rates.
The VNA offers an ideal solution in these scenarios due to its high dynamic range, overall bandwidth, and frequency / time domain transformation flexibility.
This session will cover the topic of de-embedding and offer different approaches best suited to the unique nature of individual customer designs.

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Rich Pieciak
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

In order to characterize RF Components and IC’s with a Vector Network Analyzer, the device-under-test may be hosted on a test fixture. The test fixture may be a printed circuit board with connectors and transmission lines. It is normally required to remove the effect that the fixture has on the overall measurement.
Traditionally, this has been handled by Thru-Reflect-Line Calibration (TRL). A simpler and more accurate way is to de-embed the fixture using S-parameter models. This presentation will discuss the process of de-embedding RF test fixtures, compare this method to TRL calibration, and provide best practices to obtain best results.

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John Coonrod
Rogers Corporation
Show Floor Booth 9110
Abstract

As more millimeter-wave (mmWave) applications come to market, a natural response for the RF engineer is to consider the use of Grounded Coplanar Waveguide (GCPW) circuitry for these applications. The GCPW circuit characteristics have many advantages for minimizing potential issues at mmWave frequencies. However, GCPW is very sensitive to PCB fabrication processing and the normal variations of building the circuit can cause inconsistencies with mmWave performance for circuits made in high volume manufacturing. This presentation will cover multiple areas in circuit fabrication that needs consideration for the RF engineer to minimize circuit-to-circuit inconsistencies at mmWave frequencies.

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Don Novotny
Optomec
Show Floor Booth 9110
Abstract

As the demand for millimeter wave frequency band devices is increasing; interconnect length and impedance mismatch (due to increased interconnect inductance) will drive device design. A novel method for creating impedance matched interconnect geometries -- not bound by the constant cross section of wires and ribbons -- is presented. The technique uses non-contact Aerosol Jet digital printing, which can deposit conductive metal inks onto non-planar geometries with characterized conductivity, edge quality, and surface roughness in geometries not possible with other interconnect technologies. Improved RF performance is achieved even on traditional pad-up die configurations.

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Subbaiah Pemmaiah
Copper Mountain Technologies
Show Floor Booth 9110
Abstract

Having a lossy set up between the device under test (DUT) and a vector network analyzer (VNA) presents obstacles to obtaining accurate reflection measurements. This microapp discusses a solution to improve accuracy for such setups using a portable VNA.

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Malgorzata Celuch, Say Phommakesone
QWED, Keysight Technologies
Show Floor Booth 9110
Abstract

We discuss the iNEMI 5G Project results (https://www.inemi.org/5g-mat-assessment) concerning the benchmarking of existing microwave techniques for materials’ characterisation, from the viewpoint of their aplicability, reproducibility, repeatability, and accuracy, when applied to 5G/mmWave materials. Four techniques (SCR, SPDR, BCDR, FPOR) have been identified and tested in a round-robin of 10 sample kits (including Precision Teflon, COP, and fused silica) circulated between 10 laboratories. The mApps talk will summarize the EM principles of the chosen techniques and the results of the round-robin results, introducing the attendees to the measurement setups available for hands-on experience in the exhibition booths of Keysight and QWED.

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Lawrence Wilson
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Test equipment is calibrated at its coaxial RF/microwave interface on the front panel. This defines the reference measurement plane. However, all the fixturing between the test equipment and the device under test will degrade the signals, and therefore negatively impact the test results. As latest wireless technologies use signals with higher frequencies, and wider modulation bandwidths, these impacts become bigger.
This paper will discuss these challenges, and will present new ways that can be used to remove these undesired effects, and move the measurement from the front of the test equipment to input/output of the DUT

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Lawrence Wilson
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Power Sensors are a common tool around every RF and Microwave lab, they provide very accurate power level measurements. However, the technology that enables these accurate power measurements, also has some limitations. Making narrowband power measurements or low level power measurements is not possible due to the broadband nature of a traditional power sensors.
This tutorial will take you the pros and cons for using traditional power sensors, explaining how to compliment them with a frequency selective power sensor to ensure that you can make the right power measurement at the right time.

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Nikolas Provatas
Cadence
Show Floor Booth 9110
Abstract

Silicon chips present several challenges for designers using electromagnetic (EM) simulation tools. Increasingly complex designs, miniaturization, and advanced process nodes test the limits of EM solvers in terms of capacity and modeling times. The need for cross-fabric simulation of EM parasitics adds yet another level of complexity. Cadence® EMX® Planar 3D Solver has been designed to overcome these issues. Modeling engine capacity, seamless integration in the Virtuoso® flow with real IC-Package co-simulation and a recent success story with a prominent foundry will be discussed during the presentation. 

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Matt Maxwell
Rohde & Schwarz
Show Floor Booth 9110
Abstract

Phase noise measurements of components like oscillators, PLL’s and VCO’s can differ through their design lifecycle. In advanced R&D the very best phase noise is often needed to ensure the final product has enough performance margin to be manufactured. But testing these parts in production may not require as much phase noise performance. Learn about how the R&S phase noise analyzer portfolio can help bring products to market with the right performance levels and the fastest test times available.

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Rich Pieciak
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Vector network analyzers are extremely accurate instruments used by microwave engineers. However, continuously increasing frequencies of operation and modulation bandwidths can cause concern related to the accuracy of the information being analyzed, despite utilization of best measurement practices.
Uncertainties in calibration and stack-up of tolerances from numerous sources, exacerbated by wireless network technology deployments such as 5G, utilizing the FR2 frequency range for example, can be problematic.
This presentation will highlight solutions which can ensure high VNA S-Parameter measurement accuracy and confidence. Benefits are elimination of unnecessary calibrations, reduced overall test times, and high confidence in the measurement process.

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Tim Brauner
Knowles Precision Devices
Show Floor Booth 9110
Abstract

In 2021 Integrated Microwave Corporation joined Knowles Precision Devices – the presentation will help engineers understand some different approaches to building RF Filters and how each can contribute to the Space based RF systems they are working on. The presentation will discuss the filter portfolio at Knowles Precision Devices in the context of relevant Space applications and walk the engineer through: 1, The Filter Implementation options available to address different applications 2, The Screening and Qualification choices the engineer may need to consider and 3, some examples of previous Space applications Knowles has participated in.

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Krzysztof Ciezarek
Microwave Products Group
Show Floor Booth 9110
Abstract

Electromechanical Switches offer broadband operation, low insertion loss, and linearity unmatched by solid state switches, but not all electromechanical switches are perfectly suited for ATE application. This presentation will provide details associated with the selection of electromechanical switches for ATE interfaces that include individual switches and/or switch matrices. The presentation includes a lot of real test results to show how the repeatability of the switch S parameters actually impacts the calibration and performance of the ATE interfaces. Additionally, the impact of a few other switch characteristics critical for ATE applications will be explained.

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Gavin Fisher
FormFactor
Show Floor Booth 9110
Abstract

Measurements beyond conventional coaxial limits often means more frequent changes to the banded setup. For some time there have been requests to enable measurements to go all the way to 220 GHz in a single sweep with performance levels equivalent to conventional coaxial approaches. In this presentation we will show the new optimised single sweep solution with some initial measurements. We will also present typical analytical approaches to evaluate the performance of the system using python and Wincal. We will also show the new storage pod design to enable quick and safe band swaps if needed beyond 220GHz.

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Shaun Moore
TRM Microwave
Show Floor Booth 9110
Abstract

Power Combining, passively sums the outputs of separate amplifiers, creating higher-power systems. This combining technology is used as a building block in high power solid state GaN systems. This MicroApp discusses a recommended process for a system engineer to organize the needs of the system, and to establish a set of system requirements. So, the designer of the Power Combiner has all the information they need to discuss the may configuration and performance trade-offs and limits associated with those configurations. A high-level performance trade of some popular combiner configurations will also be discussed.

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rafi hershtig
K&L Microwave
Show Floor Booth 9110
Abstract

A method for the design and construction of thin-film lumped-element microwave filters is presented. The resulting filters exhibit; Temperature Stability, Broadband Spurious-Free, Size Reduction, High Reliability and Repeatability due to their thin film process on Aluminum Titenate (Al2TiO5) construction. The necessary models for inductors and capacitors are discussed. Data from Wide-Band Multiplexers and Generating Transmission zeros from "All Pole" structures are presented. With embedded Thin Film Resistor Technology, Non-Reflective Filters with flat Group Delay are designed and manufactured. These filters are used to reduce the overshoot and transition time of instruments and improve the pulsed performance.

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Navneet Kataria
Anritsu Co.
Show Floor Booth 9110
Abstract

Microwave and mmWave testing on antenna ranges and other large test setups sometimes requires full s-parameter measurements over long distances, on the order of 25 meters or longer. Distances of this magnitude present unique challenges for high frequency VNA measurements, requiring special application techniques to maintain coherence and overcome other measurement issues in such setups. This seminar compares and contrasts different VNA techniques and instrumentation used in these applications.

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Doug Jorgesen
Marki Microwave
Show Floor Booth 9110
Abstract

The accuracy of power measurements is limited by the directivity of the device used to sample the power. While the directional coupler circuit is nearly 100 years old, Marki has recently advanced the state of the art both by applying cutting edge neural network design optimization techniques and through old fashioned bench tuning. This talk briefly reviews the techniques Marki uses to create the industry leading CBR and CE lines of elite directional couplers, then demonstrates superior measurement capability they provide.

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Sidina Wane, Joel Kirshman
eV-Technologies, StarWave-US LLC
Show Floor Booth 9110
Abstract

The configurable LNA is a versatile device that is suitable for both R&D experimental setups, where the control of gain/attenuation and bandwidth are of interest, as well as in testing and characterization applications, where a pre-amplifier may be needed for an instrument such as an oscilloscope or spectrum analyzer. It has a noise figure of 7dB and may operate in its full bandwidth mode, covering the range 10MHz-30GHz, or may alternatively serve as a selective front-end in one of 8 possible bands. It is controlled via USB and may have specific sequences of settings preloaded for fully automated operation.

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Sidina Wane, Joel Kirshman
eV-Technologies, StarWave-US LLC
Show Floor Booth 9110
Abstract

The EVT-1016/3016 family of switch-matrix and correlator systems offers various capabilities for automated test setups such as VNA port extension and over-the-air (OTA) testing of beam-steering arrays. The solid-state switch matrix allows for fast switching and offers frequency coverage up to 30GHz with accurate gain stability over temperature/time. The correlation capability supports the comparison of any pair of signals from among the 16-ports, which is useful in applications such as the evaluation of antenna patterns.

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Stavros Melachroinos
Orolia
Show Floor Booth 9110
Abstract

Today, the second generation of miniature atomic clocks are available that increase accuracy and stability by another order of magnitude (~100x over high-end OCXOs). Moreover, they have improved reliability, operate over wide temperature ranges and in harsh environments, and have excellent phase noise.
This seminar will show how our ruggedized miniature atomic clock gets its lowest power consumption amongst all available MAC technologies, especially designed for military communications, undersea reconnaissance, resilient PNT systems and in general C5ISR applications on sea, ground or aerospace can meet the harsh extended temperature ranges, altitude and vibration resistance profiles required.

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Kieran Barrett
Analog Devices, Inc.
Show Floor Booth 9110
Abstract

This presentation describes a novel PLL circuit design using ADI’s quadband VCOs comprised of four narrow bands integrated into a single package. This design delivers the benefits of the frequency range of wideband PLLs, as well as the phase noise performance and lock time of narrowband PLL performance. An on-board active loop filter circuit has been designed for optimal phase noise performance across the four frequency bands of the quadband VCO. Control circuitry has been designed for fastest switching time between bands. A phase resync feature is also demonstrated for phase critical applications such as beamforming.

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Yueying Liu
Cree Semiconductor
Show Floor Booth 9110
Abstract

In this workshop, an overview of Wolfspeed large signal nonlinear device model will be presented.
Wolfspeed GaN model has successfully assisted designers achieving many successful 5G mMIMO, Macro and Aerospace and Defense PA designs using foundry services and catalogue product parts. Designers achieved design specs with first pass iteration and greatly reduced design cost using the model. This talk will demonstrate what makes Wolfspeed’s nonlinear model to be the top-quality model in the industry with prior successful design examples presented. A detailed discussion of usage guidelines and design boundaries will be covered along with key aspects of using the model.

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Alexander Chenakin, Suresh Ojha, Sadashiv Phadnis
Anritsu Company
Show Floor Booth 9110
Abstract

Anritsu’s new Rubidium TM signal generators address today’s market demands for high-performance microwave broadband signal sources through 70 GHz. With innovation and quality as their driving principles, the Rubidium signal generators challenge traditional performance expectations with atomic-grade frequency stability and low phase noise of –140 dBc/Hz at 10 kHz offset from the 10 GHz carrier.

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Chris DeMartino
Modelithics
Show Floor Booth 9110
Abstract

Nonlinear embedding models for transistors are unique models that make it possible to design power amplifiers (PAs) without any type of load-pull analysis. An embedding model provides access to the intrinsic current generator, enabling designers to shape waveforms by directly loading the harmonics intrinsically. As a result, it is possible to perform a single simulation that determines the required multi-harmonic load and source impedance terminations at the package reference plane needed to sustain a given operating mode. This presentation demonstrates the design of a Class F PA using an embedding model for a commercially available gallium-nitride (GaN) power transistor.

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Del Pierson
XMA Corporation
Show Floor Booth 9110
Abstract

XMA Corporation is a world leader in manufacturing passive RF components for cryogenic applications primarily related to quantum computing.  Our advancements in thin film deposition, thermal anchoring, and experience at millikelvin temperatures allows XMA to share our findings with you.  XMA entered the cryogenic RF industry through deep space qualified components, and has since made product updates and expanded the product portfolio in collaboration with partners in the quantum industries.  Our goals in the quantum computing industry encourage further product refinement in adjacent markets.  XMA looks forward to sharing our goals, accomplishments, and challenges related to enhancing RF signals in the quantum computing community.

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John Gardner
Blueshift Materials
Show Floor Booth 9110
Abstract

A new high-performance polyimide film offering 85 percent air content within a structure composed of a polyimide matrix, could offer significant benefits to the printed circuit fabrication process.   This high air content material creates a substrate with excellent signal propagation properties and superior RF transparency. The combination of air content and structure delivers a processable material with exceptional microwave performance and processability using standard printed circuit fabrication techniques. 

The film has been added to the most recent revision of IPC-4202C (Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards) which describes a novel, flexible base material comprised of a reticulated polyimide film. This standard establishes the classifications, qualification, and quality requirements for flexible base dielectric materials for use in the fabrication of flexible printed boards.

This paper will review these differentiations, along with the processing capabilities, and applications. Positioned to be competitive with LCPs and PTFE’s the paper will compare the differences between Aerogel and these materials.

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Rich Pieciak
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Frequency conversion is a key aspect in the building blocks of modern radar, satellite, and wireless systems. Individual mixers at component level, block converters, and integrated subassemblies require characterization to ensure design performance.
Comprising different active and passive components, device characterization requires test of return loss, gain, embedded LO group delay, deviation from linear phase, gain compression (AM/AM), phase compression (AM/PM), intermodulation, noise figure, and spurious. These measurements take significant amounts of time across the intended bandwidths of interest.
This session will highlight a single connection VNA measurement approach addressing all of these measurements, significantly improving test time and throughput.

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Peter Bacon
pSemi, a Murata Company
Show Floor Booth 9110
Abstract

With the proliferation of new wireless operating bands in the sub-6 GHz range, and with ever-increasing carrier aggregation combinations, the RF front end is being stressed with regards to receiver desense. Identifying and addressing major contributors and mechanisms of receiver self-desense is an increasingly complicated exercise. In this session, RF design challenges in signal quality and sensitivity degradation will be reviewed and mitigation techniques discussed.

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Paul Moakes
CommAgility
Show Floor Booth 9110
Abstract

Use of mobile technologies in private networks gained traction with the release of LTE Advanced and has subsequently found applications in industrial, transport, military and satellite markets. In response to this the 3GPP specifications for 5G are being written to be inclusive of these uses cases, in particular Release 17 defines system support for Non-Terrestrial Networks (NTN) including Air-to-Ground (A2G) communication systems.
This presentation looks at the advantages of using 5G for private networks, the Release 17 features for NTN, and system design considerations for their implementation.

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Michael Foegelle
ETS-Lindgren
Show Floor Booth 9110
Abstract

Industry standards for over-the-air testing of LTE MIMO devices evaluate device performance in a spatially static environment with fixed angles of arrival. The device is then rotated in the generated test environment to obtain average performance. For 5G, the CTIA MIMO OTA working group is developing dynamic channel models that vary the spatial configuration as a function of time. By allowing link adaptation at the base station emulator, the device can choose the best MIMO or SISO diversity mode and data rate for a given channel condition. This presentation will summarize the development process and test system requirements.

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Melanie Mauersberger
Rohde & Schwarz
Show Floor Booth 9110
Abstract

In the wireless communication world, EVM is one of the main characterization parameters to rate a device’s performance. With higher modulation schemes, the EVM requirements become more stringent. At the same time, measurement scenarios become more challenging when testing modulated high bandwidth systems at millimeter wave ranges.
In order to achieve accurate EVM measurement results, a combination of high-performance measurement instrument and optimized settings for different scenarios is required. This micro-app presents how to ensure best EVM measurement performance under challenging measurement conditions.

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Tudor Williams
Filtronic
Show Floor Booth 9110
Abstract

This presentation will look at some of the RF challenges in designing the high data rate (multi Gbps) communication links needed to backhaul data between earth and the satellite or HAPS, and between the platforms themselves. It will address some of the key technological challenges for semiconductor devices, RF systems, antennas and network architectures of mmWave. It will propose why Q/V, E and W Bands represent long term viability for future systems.

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Florian Ramian
Rohde & Schwarz GmbH & Co KG
Show Floor Booth 9110
Abstract

Signals for high data rate transmissions over satellite, like the DVB-S2/-S2X or the reverse channel signal -RCS2 are defined for a wide variety of modulation- and coding schemes, in order to reach a maximum throughput for a given SNR.
During characterization, modulation quality measurements, such as EVM, MER, or BER are essential. Characteristics of the signal (multiple modulation schemes in a frame/super-frame), as well as the vast number of configurations make it extremely difficult to configure generic measurement applications manually. Configuration wizards provide an easy way to analyze S2/S2x and RCS2 signals with any bandwidth supported by the underlying hardware.

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Gerardo Orozco
NI (National Instruments)
Show Floor Booth 9110
Abstract

Testing 5G Phase Array Antennas with Over-The-Air (OTA) methodologies are a constant challenge for RF Test Engineers. The standard way of testing, taking measurements in hundreds to thousands point positions around the antenna forming a spherical grid, is time consuming. NI has developed a tight synchronization between the motion and the RF instrument to avoid stopping on every point in the grid and capture enough data for all 3GPP NR measurements. This substantially reduces total test time while increasing total accuracy as there are more points gathered and thus less systematic errors to the peak of the beam.

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Rodger Hosking
Mercury Systems
Show Floor Booth 9110
Abstract

The latest SoC technologies provide multi-channel, wide intermediate frequency (IF) bandwidth devices capable of receiving and transmitting large amounts of data.
Data from the edge sensor is often too large for direct upload to a secure cloud with the required low-latency. The latest RFSoC solutions include small form factor (SFF) ruggedized designs that use an intermediary “Fog” link to intelligently reduce the data set and achieve secure, low-latency transfer to cloud storage.
This presentation will familiarize system design engineers with key considerations and trade-offs to bridge the gap between edge sensors and a secure cloud infrastructure to optimize performance.

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Eric Carty
Analog Devices
Show Floor Booth 9110
Abstract

Analog Devices recognizes the ever-increasing demands for switch functionality and performance in the electronics test and measurement world. Using its proprietary MEMS and CMOS technology, a breakthrough Micro Relay product has been developed to deliver compelling advantages over traditional relays. The ADGM1001 is a DC to 34GHz/64Gbps SPDT MEMS switch with integrated 3.3V driver circuitry. The DC plus high-speed performance coupled with an SMD (Surface Mount Device) 5mm x 4mm x 0.9mm form factor make this switch ideal for realizing high test channel densities on ATE (Automatic Test Equipment) load and probe boards including those supporting loop back switching applications.

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Chris DeMartino
Modelithics
Show Floor Booth 9110
Abstract

RF system design can be a complex task for designers, as these designs must account for real-world environmental effects like interference. Performing simulations with accurate component models makes it possible for designers to accurately predict system performance in the presence of real-world effects. This presentation demonstrates how a library of measurement-based system-level component models can help system designers execute accurate simulations.

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Bob Buxton
Boonton
Show Floor Booth 9110
Abstract

There has long been a trade-off between performance and cost. Typically, low phase noise and fast frequency switching speed are not available in low-cost microwave signal generators. This presentation will describe how that has changed. It will outline applications, such as LO/clock substitution, frequency agile radar and communications systems, and high throughput manufacturing test, where low phase noise and/or fast switching are required. Benefits for engineers and technicians that accrue from having a high-performance signal generator for those applications will be described. Finally, it will reveal how those high levels of performance are possible in a low-cost signal generator.

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Raymond Baker
Richardson RFPD
Show Floor Booth 9110
Abstract

Software defined or converter-based communication and radar systems require high frequency, low jitter, sample clocks. Sample rates now reach single and double digit GHz, often derived from a local low frequency reference. That reference provides the needed frequency accuracy and system synchronization but may not, by itself, be suitable as a sample clock. This paper explores typical tradeoffs and methods for generating coherent, low jitter, high frequency sample clocks for wideband gigasample converters.

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Markus Loerner
Rohde & Schwarz USA, Inc.
Show Floor Booth 9110
Abstract

Latest RF frontend modules for 5G and Wi-Fi devices support many frequency bands and modes using multiple RF inputs and outputs. These drive up the connectivity requirements but also increase significantly the test requirements to ensure proper functioning in all modes, frequencies and signal configurations. Complete characterizations are getting more and more time consuming asking for high speed while maintaining excellent EVM capabilities. The session will discuss methods and setups to improve the challenge of faster testing without any compromise in RF performance.

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Joe Simanis
Nisshinbo Micro Devices
Show Floor Booth 9110
Abstract

Regarding RF Switches, key parameters of power, insertion loss and switching speed are compromised due to limitations of IC technology. Using of our unique in-house GaAs process, Nisshinbo Micro Devices has been able to achieve superior RF-IC performance. Low insertion loss is achieved at higher power while maintaining fast switching speeds. This translates to better total noise figure, and greater sensitivity in the application. We will discuss some of the key features of Nisshinbo’s front and back-end technologies and how those contribute to RF Switch performance, AEC qualification and the resulting benefits to the RF engineer.

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Kudret Unal
Analog Devices, Inc.
Show Floor Booth 9110
Abstract

It is possible to generate signals as low as 25fs jitter with using the traditional PLL parts. The agile RF systems such as automated test equipment, RF instruments, test benches or ADEF systems require much lower. The translation loop architecture is used to cancel the PFD noise contribution almost which enables the jitter needed for these systems. Translation loop design seems intimidating in the first glance regarding board area, isolation, high quality clock source requirement and lack of examples in the market. This presentation explains how to implement a translation loop by minimizing these challenges.

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Tudor Williams
Filtronic
Show Floor Booth 9110
Abstract

This presentation explores the challenges of employing GaN RF devices, it is well known that GaN devices can deliver much higher power at reduced die sizes, which is clearly beneficial in a range of applications but this increased power dependency also increases the need to design for manufacture, addressing thermal and electrical challenges as well as other design challenges such as die attach and packaging.

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Alejandro Buritica, Andrew Cobas
Tektronix
Show Floor Booth 9110
Abstract

Wireless devices are ubiquitous in the modern world. The electromagnetic signals that are being emitted by these devices create noise that can often cause signals that interfere with one another other, which can disrupt transmissions and effect their ability to properly operate. This presentation will show how commercial tools can be used to capture these noisy signals so engineers can locate and understand their characteristics. In addition to this, this presentation will show how these captured signals can be generated, or played back, to be used to test the robustness of their devices under test.

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Harley Berman
Marki Microwave
Show Floor Booth 9110
Abstract

Quantum algorithms require systems with long entanglement times undisturbed by heat or particles, demanding operation at cryogenic temperatures. As a leader in the microwave component field, Marki Microwave stands out as the premier manufacturer of the microwave components used in quantum control systems by providing microwave components which exhibit superior performance, and some that operate at cryogenic temperatures with minimal change. In this talk we will discuss how popular microwave components operate, how their behavior changes at cryogenic temperatures, and why a microwave component may fail at cryogenic temperatures.

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Jack DeGrave
FormFactor
Show Floor Booth 9110
Abstract

Quantum computing will likely utilize numerous new technologies which operate at different cryogenic temperatures. For example, a quantum computer might deploy CMOS memory modules at 77 K, superconducting control chips at 4K, and a quantum processing unit (QPU) at less than 20 mK. To develop and deploy these various subsystems and technologies, it is vital to reliably and efficiently test and measure them at or near their operating temperatures.

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Rafi Hershtig
KLMicrowave.com
Show Floor Booth 9110
Abstract

4G/5G networks are demanding multiple RF tests which require large dynamic range and versatility. Tests such as; Carrier
Aggregation, Harmonics and Jammers require digitally tunable filter solutions. In addition, with increasing data rate the requirement for Non-Reflectiveness at the ports of the D.U.T, while maintain a large dynamic range are creating a big challenge. This presentation will put together new block diagrams based on tunable and/or fixed filters to provide large dynamic range and versatility, which will cover:

  • Tunable Frequency and Band-Width for Band-Pass and Band-Reject Filters.
  • Tunable frequency of Band-Pass/Band-Stop Duplexer
  • Non-Reflective Mode Digitally Tunable Solutions

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Miodrag Tasic, Branko Kolundzija
School of Electrical Engineering, University of Belgrade, Belgrade, Serbia, WIPL-D
Show Floor Booth 9110
Abstract

WIPL-D Domain Decomposition Solver (DDS) is a tool for fast and accurate simulation of, in the electrical sense, extremely large and complex antenna placement and RCS problems. A recent breakthrough significantly increasing the solver capabilities will be presented. Efficient simulation of various antenna placement and RCS problems, with the number of HOBFs unknowns increased from 1 million to previously unthinkable 12 million, will be demonstrated. The impressive example of RCS calculation for ~1,000 wavelengths long fighter aircraft, the one belonging to the unthinkable category, in just one day, even when using a standard server machine, will also be presented.

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