MicroApps Seminars

This microapp will show how an augmented real-valued time-delay neural network (ARVTDNN) can implement a digital predistortion (DPD) subsystem for a transmitter. The DPD subsystem acts on a 5G-like signal and aims to reduce the nonlinearities induced by an NXP Doherty power amplifier (PA). Learn how to design, train, and test the network. Compare the performance of the ARVTDNN with a DPD based on traditional memory polynomial techniques, and see that the ARVTDNN reduces ACPR better than the memory polynomial DPD.

Simulating S-parameters in a time-domain (transient, periodic steady state) simulator challenges many high-speed analog and RF designers. Poor quality S-parameter models result in convergence and accuracy issues in Spectre simulation, and often it’s difficult to determine S-parameter quality prior to simulation. We will show the new Spectre S-parameter quality checker and RFM model generator, which allows designers and EM groups to examine their S-parameter models before embedding them in a full design. It also generates an RFM model from S-parameter data, which is passive and causal by construction. This increases designer productivity and makes Spectre simulations faster and more robust.

We will describe the Synopsys modern design and verification flow for Silicon RF and millimeter wave (mmWave) ICs. We will address the design of RF & mmWave IC components including 6 GHz Low Noise Amplifier (LNA), 28 GHz Power Amplifier (PA), and 28 GHz LNA using GlobalFoundries 22FDX and TSMC N16FFC interoperable process design kits (iPDK) with Synopsys Custom Compiler design/layout and PrimeSim circuit simulation tools, and with accurate electromagnetic (EM) analysis tools provided by Ansys and Keysight.

Analog Devices will discuss a wideband MxFE platform for phased array radar, electronic warfare, communications and instrumentation.  This session will describe the architecture, key specifications, and measured performance data.

At cryogenic temperatures down to 4 Kelvin, ASICs in SiGe BiCMOS technologies can control qubits in quantum computers, support astronomical detectors and operate space-borne applications. For an efficient development of these ASICs, a cryogenic Process Design Kit (Cryo-PDK) containing device models extracted down to 4 Kelvin is essential. This seminar will introduce the Cryo-PDK of IHP’s BiCMOS SG13G2 technology. The technology offers high-performance HBTs with fT/fmax = 300/500 GHz at room temperature. The performance of devices at 4 Kelvin and the results of the first benchmark circuits designed with the first Cryo-PDK version will be presented.

In this seminar recent status of a BiCMOS technology with a record SiGe HBT with a target cutoff frequency (fT) of 470 GHz and maximum oscillation frequency (Fmax) of 650 GHz will be presented. Technology measures to achieve similar device performance from the previous passive component portfolio will be presented, as well as additional device options. First design studies as sub-THz LNA and power amplifiers will be referred, demonstrating the potential of this technology option in systems and applications with particular focus on future wireless communication and high-speed optical transmission systems.

The purpose of this study is to investigate the possibility of using a smaller near-field measurement system to accurately measure the antenna pattern of a modern mmWave phased antenna array. The results made in near-field test system are then compared to the far-field results performed in a typical Compact Antenna Test Range (CATR). Measurements are made using CW and modulated signals to evaluate if the complexity of waveform effects on the results. The goal of the study is to see if correlation exists between different methods to allow a more compact and cost-effective test solution for antenna evaluation.

For optimizing the beamforming performance of antenna arrays, the beams can be constructed in two major ways: using analytical solutions or by numerical optimization techniques. In the presentation we will highlight the differences between the results obtained using these two approaches, especially regarding the side lobe level reduction and EIRP (effective isotropic radiated power) performance. Analytical solutions are fast to compute but in practical cases numerical optimization techniques are preferred due to their superior results and wider applicability.

The benefits of implementing active antenna tuning have been well established in multiple markets, not the least of which is the cellular handset market. Active tuning implementation challenges include parasitic levels of tuning circuitry, tuning component linearity, and antenna integration. Implementation benefits include a more flexible air interface, performance optimization and interference avoidance. Comparison of implementation options and solutions using pSemi Corporation tuning solutions will be discussed.

Remcom is developing XF to simplify the antenna design workflow for engineers. In XF, matching networks and corporate feed networks can be laid out in a schematic editor and solved with a frequency-domain circuit solver. Once the matching network is laid out on the PCB, parasitics are considered by circuit element optimization (CEO) as it determines the final component values.
Using a diplex matched antenna we will show system and radiation efficiencies can be effortlessly computed from a single schematic for WiFi and GNSS operating modes. These new capabilities will demonstrate advantages of using XFdtd for complex antenna design.

A 16-channel transmit, 16-channel receive phased-array development platform is leveraged for enabling RADAR, SATCOM, multi-channel communications and some electronic warfare applications. Building on the success of the Quad-MxFE Platform, this session covers how four digitizer ICs are now leveraged on a single board to improve multi-chip synchronization and system-level multichannel calibration methods often required for phased array systems. A discussion on the associated clock tree architecture is provided as well as the required power distribution network for the system. Details on the analog front-end also on the platform, which includes tunable filters, gain control and filtering is also provided to show how the digitizer IC’s hardened DSP is leveraged to correct both digital and analog channel-to-channel anomalies. Key focus areas include details about how this system is used to enable direct X-band digital beamforming using the numerically-controlled oscillators and programmable finite-impulse response filters on the platform.

The advantages of noise immunity and signal optimization in differential circuit design has pushed differential boundaries well into the mmWave region and resulted in a demand for differential on-wafer measurements beyond 145 GHz. This presentation will discuss key equipment parameters of the Anritsu VectorStar ME7838G4 Broadband System and MPI differential probes, that enable true differential measurement up to 220 GHz. Description of important aspects of VectorStar broadband systems such as raw and corrected port parameters and factors that can affect calibration and measurement stability, will be presented. On-wafer measurement concerns to obtain calibration and measurement optimization will also be discussed.

Rohde & Schwarz is known for high end solutions in Research and Development. But characterization and production has its own rules with much more focus on speed and parallel testing.
This session is about translating R&D performance into high speed and parallel test applications while maintaining standard compliant test scenarios for the latest mobile communication standards.

New designs starts in design software and simulation. The important topic is how good can later usage be simulated at an early design phase for risk mitigation. To get as close as possible one wants to simulate with real application data and understand the system level performance with standard compliant key performance indicators such as EVM. Ideally for an active system, the design phase allows a closer look to performance improvement using digital predistortion. This session will look into methods to control risks in the design while looking at standard compliant performance and possible enhancements using DPD.

A number of RF communication channel types pose frequency-response measurement challenges that conventional 2-port VNAs cannot accommodate due to limited access to or disparate locations of the channel's input and output ports. The Vector Channel Analyzer (VCA) is a new synthetic (software only) instrument, hosted on Astronics Test Systems' ATS-3100 RTS radio test set, that can perform frequency transfer-function measurements quickly over bandwidths up to 40 MHz on local in-line or physically distributed RF channels using a single VCA-enabled ATS-3100 RTS unit. This MicroApp describes the VCA and its use on several RF channel examples.

Testing today’s complex radio frequency devices needs a multi channel approach to vector signal analysis that simplifies the measurement of input to output distortion expansion, compares a transceiver stimulus to its response, and aligns multi channel sources and antennas. Tektronix delivers a VSA solution that is accurate, and highly correlated across channels. Tektronix will present applications to IoT transceivers, front end modules, and power amplifiers using Tektronix vector signal analysis platforms and software. Tektronix VSA solutions are intuitive to setup and deliver not just fast measurements but actionable insight.

A recently observed rapid growth of the interest in microwave properties of low-loss coolant liquids, which are increasingly exploited for high-frequency electronics immersion, has prompted development of high accuracy material characterization techniques. A family of measurement fixtures, including dielectric resonators and a Fabry-Perot open resonator dedicated for accurate and reliable characterization of liquids in a broad frequency bandwidth, will be presented. The measurement fixtures are designated for various kind of liquids, with the loss tangent spanning from 10-4 up to 10. Moreover, measurements of the complex permittivity of liquids versus temperature are enabled with the dielectric and cavity resonators.

As the next generation of 5G mobile network, autonomous driving and IoT take shape, engineers are racing to design more wireless devices to meet accelerating market demand. Simultaneously, the density and complexity of electromagnetic environment are increasing since the number of wireless devices are increasing. These dynamics pose challenges for EMC testing as the number of regulatory and wireless compliance standards increase.
This MicroApp presentation will discuss how to use RTSC measurement to perform EMC testing that can detect and
evaluate fast transient signal measurements using 350 MHz wide fast Fourier Transform (FFT) bandwidth.

Shielding properties of graphene-based polymer composites (GBPC) are enhanced by uniform dispersion of graphene flakes within the polymer matrix. Little attention has been given thus far to the rigorous studies of spatial inhomogenetities of the electrical and dielectric properties of GBPCs, due to nonuniform filler distribution in practical fabrication. We present:
- A microwave technique producing 2D quantitative maps of resistivity of GBPCs; QWED's 2D dielectric-resonator-based scanner is applied.
- Experimental results for large (10cm x 10cm) GBPC panels, demonstrating a tremendous effect of the fabrication process parameters on inhomogeneities of the resistivity, which degrade the shielding efficiency.

The contactless flanges which perform fast and reliable mmWave measurement without the effort of tightening up screws are presented. Good electrical contact is not required between the waveguide flanges of the DUT and the test equipment. This presentation compares measurement results obtained with VNA test systems that use either contactless flanges or conventional flanges for the test ports. The test results will be compared in terms accuracy, repeatability, how long it takes to perform calibrations and measurements. Eravant has designed and fabricated the contactless flanges working up to 325 GHz, and the measurement results of contactless flanges will be shown.

This in-depth panel session will be moderated by Microwave Journal Technical Editor Eric Higham. The panelists will consist of senior executives from Keysight Technologies, Rohde & Schwarz, Analog Devices and Qorvo. Research on emerging technology trends and markets will be discussed. Panelists will share their company’s visions and insights into the markets that will fuel future growth.

RF systems include waveform processing and carrier generation subsystems that require high frequency, low phase noise and/or low jitter frequency sources. Those low noise signal sources almost always begin with a precision reference oscillator that determines the fundamental performance of the overall system. Particular attention will be paid to wide bandwidth PLLs which require ultra-low phase noise reference sources to maximize their performance. This presentation will show how to derive the reference oscillator requirements from top level specs, select an appropriate technology, tools which can be used to estimate performance and practical considerations that optimize and deliver the required performance.

Power measurement is one of the most fundamental types of RF and microwave measurement. Because of that, at first glance, it would seem to be a simple thing when compared with other types of measurement; isn’t it a single numerical result? Well yes and no! This presentation will highlight the various power sensor technologies and the way that different applications and measurement requirements can drive different decisions. It will relate the capability of power measurement tools to the most demanding measurements across applications ranging from radar to communications. In doing so it will highlight the significance of sensor selection choices.

In this microapp, various applications for 6G and how the 6G devices are being measured at extreme high frequencies (D, G and J band) will be discussed. As the frequencies are going higher and higher and the size of the devices on wafer are becoming smaller and smaller, making accurate and precise measurements is becoming challenging. The complexity of 6G devices and their designs forces the device modelers to push the limits of today's available instrumentation to make precise measurements. Differential mixers/amplifier and fundamental device characterization with a broadband 70 KHz to 220 GHz VNA would be discussed in this micro app.

While 5G is getting more mature and the usage is in full swing, R&D is already looking at what comes next. 6G is also extending its frequencies for new applications like sensing and high bandwidth data transmissions into the THz region. The D-Band between 110 to 170 GHz is a hot candidate in the research arena. The session will discuss THz applications and how to test the modulation accuracy for channel modelling and semiconductor research in the D-Band in a simple and straight forward way.

VCOs are deployed in almost every digital data communication from any wireless system to digital data transfer as RF generator or clock generator. Making sure they are performing to the required level of signal purity is a a task for a VCO tester. It not only looks at drive levels to control the outputs frequency etc. but also looks at the signal purity provided. This session is offering a comprehensive inside for fast and easy VCO testing.

Performance requirements for today’s microwave devices are leading to shrinking geometries, complex 3-dimensional structures, and new materials. Additional to increasing power densities, devices are being deployed in mission-critical applications. Devices may also be required to operate in challenging thermal environments. High temperatures, hot spots and temperature spikes can have a major impact on reliability. Since high temperatures contribute to MTTF, it is essential that one have a thorough understanding of static and dynamic thermal performance. Fortunately, advances in characterization techniques and thermal testing services are making it easier to gain this understanding to ensure reliability while meeting challenging performance requirements.

A unique type of equipment, dedicated to accurate and highly repeatable measurement of the complex permittivity of materials in the 10-130 GHz range, will be presented. Its automated operation in a single-sweep mode is essential for industry as the characterization of materials for 5G/6G applications is now the matter of a few minutes only. It will be shown that both in-plane isotropic and anisotropic materials, such as plastics, laminates, glasses and semiconductors, the losses of which are spanning from 10-5 to 10-1, can be characterized with accuracy as high as 0.5% for dielectric constant and 2% for loss tangent.

Selecting a suitable RF-optimized package for ICs, monolithic microwave ICs (MMICs), and systems in packages (SiPs) is critical for a broad range of applications such as mobile phones, wireless networks, ultra-wideband (UWB), IoT, GPS, and Bluetooth. With the myriad of options available when it comes to choosing an appropriate package for the given application, it is essential to perform thorough electromagnetic (EM) and thermal simulation and modeling. This presentation demonstrates how a library of 3D parts can be generated quickly and easily within the Cadence AWR Design Environment to support accurate EM and thermal simulations across multiple, heterogeneous technologies.

This microapp will show how you can define a multi-satellite constellation in MATLAB. Propagate the satellite orbits and perform downlink closure analysis on assets like ground stations or aircraft. Add a variety of antennas to the transmitters or receivers and assess their impact on link closure. Mitigate spatial interference through the use of phased arrays. Visualize links closing and opening and use the link closure information to support downstream decision-making.

CMOS SOI technologies are ideally suited for RF and mmWave applications in 5G and emerging 6G bands owing to high integration in CMOS platforms and low parasitic capacitance relative to bulk CMOS. The Synopsys RF DTCO flow enables exploration and optimization of CMOS SOI transistor designs and process derivatives using RF/mmWave circuit figures-of-merit through a flow starting with TCAD process and device simulations to produce RF target data, whence a BSIM4-SOI SPICE model extracted for RF circuit simulation, thereby enabling rigorous optimization of the transistor design before committing to expensive wafer-based validation.

Design, analyze and optimize antennas, arrays using full-wave electromagnetic modeling. Run installed antenna scenarios to understand the impact of placing radiating elements around platforms. Perform radar cross section analysis on metal and dielectric structures. Understand the different solvers and the relevant tradeoffs in accuracy, memory and time requirements.

Ungrounded components don’t have a path to remove heat built in. In tightly packed boards this can cause hot spots and reduce the life and functionality of components. This study will investigate using a thermal pipe to electrically isolate the component while providing a thermal conduction path to ground.

This presentation explores how D-Band enables the potential for next generation, ultra-high-capacity wireless links for 6G and beyond. Moving to D-Band is a fundamental shift and will require radical redesign due to the very high frequencies. This presentation will explore why a shift to higher mmWave is required and outline the challenges associated with manufacturing transceivers in volume at such high frequency, including the availability of power semiconductor processes, device interconnects and packaging constraints.

A 3kW power amplifier pallet / module for Direct Energy Applications at S-Band is presented. The uniqueness of this solid-state power amplifier is based on the RF AlGaN/GaN on SiC transistors which can be operated at 100V bias rather than standard 50V. The amplifier covers the frequency range of 2.5 – 3.1 GHz with a signal of 100 us pulse width and 1% duty cycle, with 50 ohm input and output impedance. The presentation discusses the amplifier circuit design which combines two 1.7kW peak-power GaN on SiC transistors operated at 100V DC bias.

Millimeter-wave (mmWave) 5G solutions underscore the need for both high-power and highly linear RF power amplifiers but too often companies must sacrifice one for the other. Traditional approaches to developing mmWave PAs either back off the PA’s power or use digital predistortion (DPD). Neither is ideal: one approach uses too much power and the other adds system complexity and cost, resulting in non-optimal solutions. In this MicroApp session, mmTron will compare the linearity curves of traditional mmWave PAs to the performance of a new class of high power highly linear PAs with explanation of the resulting system and end-user benefits.

High-power radio design has traditionally utilized PIN-diode technology to realize the RF-switch function in RF front-end design. This technology was adequate due to limited frequency bands. However, modern high-power base stations and Tactical/Mil Comm Radios are required to cover many bands to meet the demand for secure voice-data-communication. Majority of 5G-base-station Remote-Radio-Head architecture is based on massive MIMO where many Radio-Frequency-Front-End (RFFE) need to be implemented in constrained board space. Loss requirements are also stringent to manage total thermal dissipation. High power GaN switch technology from Tagore Technology is addressing many of the challenges highlighted above for high power Radio design.

The electronic devices we use every day need to pass certain regulatory requirements before they can be marketed and sold. Phantom models with homogeneous material definitions are typically used to mimic the material composition of the human body, this substitution does not provide enough insight into what’s actually happening inside the body. Having the detailed model of the muscle tissues, blood vessels and internal organs in simulation will be beneficial in understanding the behavior of local heating of the respective materials, helping with the deeper understanding of local heating, leading to much faster and safer designs.

At present, conventional technologies such as Computed Tomography (CT) and Magnetic Resonance Imaging (MRI), which provide high-resolution images, still have several limitations such as their long examination time, non-portability, high cost, and also ionizing radiation.
Microwave Imaging (MWI) that utilizes harmless non-ionizing radiation and affordable components has the potential to be used in various medical applications (detection of tumor/stroke/increased lymph nodes inside different human body parts).
A step-by-step stroke-detection scenario using the MWI algorithm implemented into a powerful 3D EM simulation environment built around a general-purpose 3D EM solver with libraries of phantoms and appropriate antennas.

Microwave acoustic filters (SAW/BAW) are ubiquitous technologies in the modern handset RF front end; a state-of-the-art 5G phone can have nearly 100 acoustic filter functions. Because SAW/BAW filters rely on mechanical resonance, much of their key performance parameters are temperature dependent, the need for thermal simulation early in the filter design flow is critical. This presentation will highlight a thermal co-simulation process in which designers can use resonator operating temperature information to optimize resonator size, filter layout, and other geometric parameters to ensure filter performance meets the required specifications for performance and reliability.

Waveguide switches are a commonly used part in RF communication systems. Historically, most waveguide switches are only offered up to cover 110 GHz. As the industry is gearing up to expand to 6G, there will be a need for waveguide switches that can operate at higher frequencies, especially at the sub-THz frequencies. To fulfill this need, Eravant has developed full-band WR-08, WR-06, and WR-05 waveguide electromechanical switches to cover up to 220 GHz. The presentation will include detailed product specifications and measured performance. It will also cover current and anticipated applications for Test and Measurement systems, telecommunications, and space-based systems.

The use of complex multilayer printed circuit boards has become the norm for even the simplest of RF boards in order to cross over an RF or digital trace. The disadvantage to this is the added cost that multilayer PCB processing incurs. The use of a component style crossover device eliminates the need for multilayer PCB’s in some cases. Current crossover devices available today only operate up to ~6GHz. This presentation will focus on a new style of surface mount RF crossover component that can operate from DC to 40GHz.

The new 5G cellular network operates at 3.3 to 3.6 GHz poses interference concerns with the C-Band satellite communication terminals which receive Space-to-Earth signals in the 3.4 to 4.2 GHz band and transmit signals in the range of 5.85 GHz to 6.425 GHz. It can also interfere with radio altimeters operate between 4.2 to 4.4 GHz. In the case of Satcom, the interference-mitigating LNB does not completely eliminate the interference problem and some additional filtering before the LNB may be required. This paper presents McV RED and BLUE filter solutions which successfully suppress all spurious signals for Satcom receive and transmit frequencies.

Integrated passive devices (IPD) have been prevalent in RF front-end modules in both cellular and wireless connectivity applications due to its advantages in terms of compact size, manufacturing consistency, integration capability, and low cost. Various technologies such as high-resistivity silicon based and through-glass-via (TGV) based IPD have been developed. Their use in RFFEM for 5G NR filters will be demonstrated and compared. Besides the cellular applications, IPD for IoT and wireless connectivity market is also introduced. Integration of multiple passive functions such as balun, divider, filter, and matching network enables IPD as an all-in-one die for this type of application.

The microwave/millimeter wave gap capacitor was designed as a replacement for single layer wire-bondable ceramic capacitors. The move from wire-bond to surface mount design eliminates the variance and induction of the bond wire and simplifies manufacturing. The Eulex gap capacitor design achieves this while still maintaining the frequency performance of the true single layer capacitor.

There is no other product like ours on the market today. Our patent gives us significant advantages over our competitors' products. Our unique internal structure allows us to gain up to 20X the capacitance of our competition for the same dielectric, case size, and voltage. This capacitance leverage is further extended at lower voltages not available in our competitors’ configuration.

Quantic Eulex develops innovative ceramic components for the most demanding high-frequency microwave, millimeter-wave, and 5G applications. Eulex solutions deliver design advantages through small-footprint, low-profiling packaging, and a wide voltage range, fully tested up to 50Ghz with a roadmap planned from 6.5 to 100 GHz. The reliability of Quantic Eulex capacitors is well-established, at temperatures ranging from ranging from -55° to 125°C.

Optical fibers provide a convenient way to distribute RF signals in radar and telemetry systems. However, the optical fiber length has a temperature dependence of 40 ps/km/K leading to phase variation. In this presentation we present methods to compensate for the phase changes. Phase stability to one ps has been demonstrated for a few km of single mode fiber. The length can be increased using temperature compensated fibers.

S-parameters files of passive components are typically available from vendors to be used during circuit/system design. However, the S-parameters model is obtained from vendor’s specific layouts and test boards. When the component is mounted on customers PCB the performance deviates from the typical one, normally due to changes in the layout/stackup and proximity with other components. Extensive EM-Circuital co-simulations are then needed when a more accurate prediction is crucial. This MicroApp discusses recommended techniques for predicting and optimizing the performance of TTM Technologies passives on custom PCB’s by using circuital and EM simulations with both S-parameters and proprietary 3D-EM models.

The effects of hot switching on the life span of MEMS switches was tested at a variety of RF CW power levels. The switch was cycled at 10 kHz to failure. Over the test, the RF power was measured before and after the channel under test and showed that the insertion loss of the device remained stable. Increasing the frequency of the RF signal or slowing the slew rate of the gate signal to the MEMS causes the life span of the switch to degrade quicker. Protection circuits can be used to help mitigate the impact of hot switching.

In this presentation, we introduce design concepts and guidelines for 3D printing of low loss dielectric devices manufactured with Rogers Radix photopolymer resin. The audience will learn how the Fortify Digital Light Processing (DLP) 3D printing process works, the benefits that 3D printed dielectrics offer to device design flexibility, and the impact of these capabilities on demonstrator device performance. The presentation will touch on GRIN (Gradient Refractive Index) device design, introduce the considerations and boundaries for designing for this process, and discuss the workflow a design engineer should consider when designing a device.

3D printable Radix(TM) Dielectric materials have excellent and consistent RF properties such as controlled dielectric constant at 2.8, dissipation factor of 0.0043 when tested at 10 GHz, very low moisture absorption and the ability to be used with lead-free solder reflow. This presentation will give a brief overview of the Radix material and how it has been used with the GRIN technology. Additionally, other 3D printed, novel RF structures, will be explained and results shown for the modeling and measured RF performance.

There are several circuit material properties that can impact thermal stability, such as Thermal Coefficient of Dk (TCDk), thermal Coefficient of Df (TCDf), moisture absorption and Coefficient of Thermal Expansion (CTE). There are multiple normal variations within the processes for circuit fabrication that can also impact changes in RF performance. Finally, a changing operating environment can also impact thermal stability. Data and explanations will be given, using circuits operating at mmWave frequencies, for thermal stability related to circuit materials, PCB fabrication and end-use environment.

Large scale phased array design and analysis is complicated through the necessary use of multi-layered radomes for environmental protection.  Designers must be able to understand the impacts of the radome on array performance such as beemsteering error and cross-polarization isolation. Advanced EM simulation empowers users to rapidly and accurately analyze these complex structures to ensure designs meet intended performance. 

The space sector has evolved rapidly over the past decades. Today, entirely new players, driven by commercial interest and supported by private investors such as SpaceX, Spire or OneWeb are well known to deliver the dominating number of new low Earth orbit (LEO) satellite systems. But not only those well-known big players, but also a plethora of small and mid-size enterprises making good business in that new economical field emerged. This recent commercialization is commonly referred to as "New Space". One key aspect of the interest especially in LEO is cheaper access to space, with various developments of reusable and low-cost launches. This comes together with new design & manufacturing paradigms for satellite systems, moving the focus away from the ultra-reliable monolithic integrated large spacecraft to typically much smaller satellites, designed for mass production.

The IEEE Low-Earth-Orbit (LEO) Satellites & Systems is a project of the IEEE Future Directions Committee (FDC) that focuses on those recent developments. IEEE LEO SatS envisions to consolidate various distributed satellite activities around the globe and provides a focus on technology, science, education and awareness. Primary goal is to increase cooperation in LEO Satellite and Systems between professionals in academia, industry and government. For IMS 2023, "Space" has become a special focus theme. Thus, by addressing the advancing relevant technologies of LEO SatS, and to attract high-quality university and college students to IEEE through the collaboration with young and seasoned professionals, the IEEE IMS MicroApps platform would be a great opportunity for both all of us.

In this Microapp presentation, an innovative distributed modular VNA architecture powered by PhaseLync technology will be presented that can dramatically simplify the setup, calibration, and measurement for both total path loss and group delay. By having two ports of the VNA spaced out by a distance greater than 20m/50m and > 100m and still be able to make vector corrected S parameter measurements opens up for solving many issues with the primitive way of making traditional measurements.
A competitive analysis will be presented between distributed modular VNA enabled by PhaseLync technology and traditional bench top VNA method.

When it comes to calibrate and align the reference oscillator in a signal source, frequency accuracy and frequency stability are key values. Frequency counters will consume too much time to perform this measurement with enough accuracy.
This paper describes a different method to measure and characterize frequency accuracy. The frequency measurement in modern signal analyzers is based on the signal phase transients – a parameter that is strictly related to the frequency accuracy of the measured signal. The frequency accuracy or frequency offset is calculated from the phase transients, and even very small errors of 1E-12 are measured within seconds.

Automotive and A&D radar applications often use linear FMCW signals, so-called chirp signals. Phase noise has a strong impact on the system performance regarding range and velocity resolution and target detection sensitivity. A transient phase noise measurement application measures the phase noise of chirps or hopping signals and helps to understand the impact of it on system performance. By removing the chirp modulation it is possible to calculate the PN spectrum with the minimum offset frequency limited by the chirp length. In addition, a frequency and the phase deviation spectrogram reveals the behavior of unwanted mixing products or spurs.

For testing at mmWave frequencies, the probe final positioning tolerances are critical.  Z variation of substrate to probe tip can be a significant final positioning error contributor, potentially due to inadvertent contaminants on the rear of the substrate which affect planarity. Using mmWave spot measurements, accurate contact can be very accurately determined. Using Formfactor WinCal XE calibration software, and Python scripting in conjunction with our Velox prober control software, these Z variations can be removed by sensing contact and adjusting on the fly. We will show example Python scripting and video of a real-life calibration incorporating dynamic Z adjustment.

A novel near-field probe for measuring an array antenna in the near-field is presented. The probe operating frequency is scalable to all FR2 frequency bands. In this paper, all results from measurements and 3D-field simulations are in the 28 GHz range. Different use cases and test scenarios from simple pre-check to beamforming verification are described.

When Wi-Fi 6 Extended, which refers to the ability to operate Wi-Fi in the 6 GHz band, was announced, the industry rejoiced for it was the first time in 20 years that Wi-Fi technology was allocated an additional spectrum. Users are still in the process of upgrading to 6 and 6E, but the next generation of wireless technology, Wi-Fi 7 is already on the horizon, promising even higher data rates and lower latency. What does the adoption of 6 and 6E look like now and when and what can we expect from Wi-Fi 7, and what regulatory testing changes?

The frequency range beyond 50 GHz up to 170 GHz is important for new communication applications like the upcoming 6G standard. Low phase noise is essential to get a good modulation performance (EVM) and an accurate measurement of it is needed to improve the performance of the used oscillators. A plug and play test setup for phase noise test up to 170 GHz is described, which consists of just two harmonic mixers in combination with a commercially available phase noise tester. The two receive paths enable cross correlation to suppress the inherent noise of the T&M equipment.

We will present a seamless, lower risk, way to develop the hardware and software for a complete phased array radar (or communications) system prototype. This will be a live demonstration of how to use existing hardware and software to quickly prototype from 2, then to 8, then 16, and finally 32 elements. Each system will use the same open source software. And each “level” of the system will increase the technology readiness level (TRL) of the program. This allows rapid development of hardware or software-or even both simultaneously--at a variety of starting points.

This presentation will address how the exponential growth in Low Earth Orbit satellites will require the move to Q /V-Band for feeder links, and indeed the International Telecommunication Union (ITU) has already approved these bands for use in forthcoming constellations. Q/V-Band provides up to 3 GHz of bandwidth ideal for high-capacity feeder links. Looking further into the future, even higher frequencies will offer greater scope for expansion, with E-Band providing two wide-open 5 GHz segments of contiguous bandwidth.

The ground stations as well as the satellites will need linear power amplifiers (PAs) to allow the efficient transmission of this information. This presentation will share the progress in advancing the state-of-the-art PA linearization at V-Band  (47 to 52 GHz) satellite uplink bands. Both analog predistortion (PD) and digital predistortion linearization (PDL) and their individual advantages will be covered. Current linearizer modules provide gain, commandable attenuators, commandable predistortion characteristics, and enough RF power to directly drive a TWTA or SSPA. Measured data (power transfer, C/I, ACPR, and efficiency) will be shared for each band before and after linearization is applied.

A new highly versatile linearizer front end has been developed for use on next-generation satellites. This linearizer was designed to enable power amplifiers (PAs) to operate over a very wide range of frequencies (> 3 GHz bandwidth) and power levels, yet still maintain optimum linearity and efficiency. The linearizer described here operates with a “Nano” microwave power module (MPM) but can be used with other types of TWTAs and SSPAs for shaped, multibeam, and phased array applications.

Global Positioning Systems (GPS) provide accurate position, navigation, and timing (PNT) information, and are vulnerable to electromagnetic interference from intentional and unintentional sources. Commercial businesses such as Ligado Networks are increasingly acquiring L-Band spectrum portions for 5G and IoT services, placing GPS receivers at risk. Metamagnetics' Self-Adaptive Filter for Enhanced Anti-jam GPS (SAFE-GPS) module enables these receivers to operate in the presence of interference by selectively attenuating high-power signals. Integrating the module into receivers provides a novel means of spectrum management that improves resiliency in congested environments. This workshop's goal is to demonstrate the Metamagnetics' SAFE-GPS module's functionality and potential.

Jammers, a special type of interfering emitter, are used to protect people. Whether they protect government leaders in their state coaches or protect emergency forces, uniformed or non-uniformed, from IEDs (Improvised explosive device).
The dark side of jamming ranges from simply preventing the location of stolen luxury limos to disrupting the communications of rescue and security forces.
We will show what a GPS signal and a commercial GPS jammer signal looks like. Then we will show in a video a locating that signal source with Narda Signal Shark receiver plus automatic direction finding and discuss the process.

Board space limitations are pushing for smaller components and greater component density, while maintaining or improving broadband performance. The industry has tried to accommodate board limitations by embedding components within the board material itself. Even though many passive components are designed to have a minimal part height, traditional capacitors are thicker components, which makes them undesirable for embedded solutions. This study focuses on the Metal Oxide Silicon (MOS) Capacitor technology, and how these capacitors are ideal for embeddable applications, and help improve high frequency performance.

Operating in harsh environments such as space requires additional attention to materials, screening and manufacturing to prevent the degradation and destruction of components. This presentation discusses how space qualified microwave components are designed and manufactured from concept to production. In addition, real world use cases will be discussed regarding the challenges to meet the requirements for MIL-PRF-38534 Class K – the most stringent and highest reliability level, intended for space.

This session will give practical design guidance to prevent Multipacting in passive microwave devices. We will start with a brief overview of the Multipaction breakdown failure mechanism, including the conditions that must be present for this failure mode to occur. The Multipaction failure mode will briefly be contrasted to the Corona breakdown failure mode. Some general approaches to predict the Multipaction failure mode will be presented. By applying the principles of what allows multipaction to occur, design approaches that will not support multipaction in passive microwave structures will be presented.

Surface mount technology (SMT) packages in the millimeter-wave range call for devices with smaller form factors and improved performance to meet demands for wireless and mobile applications. Devices pushing 40GHz and beyond see decreased performance caused by parasitic inductances and capacitances from MMIC packaging. These die-to-PCB transition parasitics can be minimized by well-matched impedance transitions, careful material selection, and novel packaging techniques as those used in Marki Microwave components. This presentation explores MMIC packaging options, techniques, and considerations to maximize RF component performance in SMT packages.

As the demand for mm-Wave semiconductors continues to grow, so does the demand for higher performance, lower-loss IC packaging schemes and interconnect methods. Aerosol Jet interconnects are directly-printed microstrips that, unlike traditional wirebonds, have zero loop height and are capable of arbitrary shapes resulting in lower-loss interconnects in the mm-Wave region. In this presentation, several interconnect schemes and material property combinations will be discussed. In addition, RF simulation data and a sensitivity analysis will be presented to assist RF designers in understanding the performance impacts of geometry, resistivity, Dk and Df.

Modern frequency synthesis utilizes advanced logic with embedded VCOs or DDS circuits. Discrete analog phase-lock techniques, however, still provide unmatched low-noise performance and remain the microwave system designer's best choice for demanding applications. This talk will discuss differentiating, analog, UHF to Q-Band sources. The Narda-MITEQ Single Loop Coaxial Resonant Oscillator (SLCRO) and Dual Loop Coaxial Resonant Oscillator (DLCRO) have bipolar voltage-controlled devices and silicon analog phase detectors configured for reference direct lock or a proprietary dual loop technique. The DLCRO provides excellent phase noise and resolution well below the reference integer intervals where digital lock techniques are normally required.

As access to and utilization of the low Earth orbit (LEO) region has expanded, so too has demand increased for affordable, mass producible space-worthy timing devices. In this MicroApps presentation we outline the ideal approach, process, and end results of adapting and qualifying an oscillators to production for commercial LEO space applications.