Integration and Packaging for Systems at mm-Wave and THz Frequencies

As the technology at mm-wave and THz frequencies matures, there is increasing need for integration and packaging solutions to have reliable systems at these frequencies. In this lecture, we will provide some of the concepts that we have been working on which have shown promising results. We will present system performances with silicon micromachined packing to hybrid approach of SoC silicon technology integrated with waveguide based low-loss packing at mm-wave and THz frequencies.