Additively manufactured Reconfigurable Intelligent Surfaces for B5G/6G Sub-GHz Applications
In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF electronics, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of mm-wave/B5G/sub-THz Modules for Smart Cities and Smart Sensing. Prof. Tentzeris will touch on the state-of-the-art area of fully-integrated printable broadband wireless modules covering characterization of 3D printed materials up above E-band, novel printable “ramp” interconnects and cavities for IC embedding as well as printable structures for self-diagnostic and pathogen sensing. The presented approach could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and “rugged” encapsulations for wearable and implantable applications. Prof. Tentzeris will discuss issues concerning the power sources of “near-perpetual” RF modules, including flexible miniaturized batteries as well as power-scavenging approaches involving thermal, EM, vibration and solar energy forms. The final step of the presentation will involve examples from shape-changing 4D-printed (origami) packages, reflectarrays and mm-wave wearable (eg biomonitoring) antennas and RF modules. Special attention will be paid on the integration of ultrabroadband (Gb/sec) inkjet-printed nanotechnology-based backscattering communication modules as well as miniaturized printable wireless (eg CNT) sensors coupling Internet of Things (IoT) and 5G/B5G with smart cities and smart biomonitoring applications. It has to be noted that the talk will review and present challenges for inkjet-printed organic active and nonlinear devices as well as future directions in the area of environmentally-friendly (“green”) RF electronics and “smart-skin” conformal sensors.