Advanced Thermal Characterization of GaN Devices, From Micro to Nanoscale, and New Heating Sinking Solutions

Heat sinking is of ever increasing importance in semiconductor device technology. I will report on the latest advancements in thermal characterization techniques of devices with high spatial resolution, to the measurement of thermal conductivity and thermal boundary resistance of materials used for wide bandgap semiconductor device applications, using techniques ranging from Raman thermography, HQTI to low frequency FDTR. Examples of GaN, Ga2O3 to packaging materials will be used.