3D Integration and Cryogenic Packaging for Superconducting Qubits
The superconducting qubit platform has advanced over the past twenty years from fundamental explorations to the deployment of many-qubit systems that support complex algorithms. Along the way, cryogenic quantum packaging has evolved from utilitarian designs with a few basic input/output ports, to sophisticated, well-modeled systems that can make or break the performance of quantum processors. At the same time, 3D integration has emerged as a critical enabling technology for signal routing, control, and measurement of qubits in an extended array, creating a bridge between packaging and the qubits themselves. In this talk, I will describe work at MIT and MIT Lincoln Laboratory to develop quantum-compatible cryogenic packaging and 3D integration techniques, and will describe new designs and applications that this technology enables.