RFIC design challenges dealing with mm-wave massive MIMO radars

While markets of Automotive and Smart Home are searching for low-cost high-resolution sensors to support their new lifesaving or convenience enhancement applications RFIC design engineers are facing new system-oriented challenges whereas chip level design consideration play an increasing role in the complete system. Low-cost solutions for high resolution applications sets challenges of integration while multiple transmit and receive antennas are densely brought together with digital processing, memory, and complex DC schemes on a single chip solution. Challenges such as isolation, calibrations, heat dissipation and layout floor-planning are now hardly dependent on RFIC and package design engineers and their cooperation. On this coming workshop session, the intention is to expose RFIC designers and RF system engineers to oversee the bigger picture including the market and application to be able to provide the most adequate solution.