Chiplets’ Central Role in Connectivity and AI Everywhere

The potential for chiplet technology to be a transformational paradigm is now widely recognized. The cost, time-to-market, and power consumption benefits of chipset-based solutions are compelling our industry towards solutions that integrate multiple dies in a single package. AI has emerged as a primary catalyst for this trend. Custom silicon designed for AI benefits significantly from the chiplet approach, combining dense logic and memory with the need for high-speed connectivity. The push for custom AI hardware is rapidly evolving, with a focus on energy-efficient designs. Chiplets offer the flexibility to create systems-in-package, striking the right balance between cost, power, and performance for specific workloads without starting from scratch every time. AI's unique needs for inter-die communication mean that reducing latency is crucial, and the roll-out of larger clusters is emphasizing the role of high-speed, optical interconnects. Of course, the application of chiplets extends beyond AI, with growing use in high-performance computing (HPC), next generation 6G communication, and data center networking. Finding connectivity solutions that satisfy the requirements of these varied applications is essential to fulfilling the potential of chiplets and opening new avenues for innovation across the industry.