Die-to-die interconnect based on high speed GaN micro-LED has become a viable alternative to SERDES-based electrical links. This emerging approach to chiplet interconnection leverages the maturity of the technology in display industry that involves the fabrication of large arrays of microLEDs and their assembly on glass or silicon driver chips at high yields. This talk discusses the D2D solution based on micro-LED arrays and presents examples of using this technology for high density, low-power and low-latency in-package interconnectivity.