Detachable Terahertz Chip-to-Chip Interconnectors

This paper presents the design, simulation, and measurement of a detachable chip-to-chip interconnect operating from 140 to 220 GHz (the WR5.1 band). The design uses a 15-┬Ám thick silicon substrate and is based on a self-holding interference taper which provides a self-aligned mechanical contact with sufficient force to ensure a low contact resistance. The measured results show good return loss across the WR5.1 band and better than 10 dB from 165 to 220 GHz. The measured insertion loss of the prototype chip (including 28 mm of WR5.1 waveguide and 4 mm of rectangular coax) is better than 2 dB across the band.