RF-Heterointegration at Wafer-Level and Panel-Level for mm-Wave Applications

This talk will cover the mm-wave packaging activities within IMEC’s Advanced-RF department. First, we present an RF-optimized waferscale silicon interposer technology for integration of III-V power amplifiers, antennas and silicon beamformers for above-100GHz communication. Second, we shall present PCB embedded Air-Filled Waveguides and their integration with radar MMICs at 79 and 140GHz as well as Antenna-in-Package solutions at 140GHz as examples of panel-level solutions.