Zero-Power Flexible Wireless Modules and Additively Manufactured Electronics for IoT, SmartAg and Smart Cities Ultra-Broadband Applications
In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF electronics, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of mm-wave modules for communication, energy harvesting and sensing applications. Prof. Tentzeris will touch on the state-of-the-art area of fully-integrated printable broadband wireless power transfer, energy harvesters and 5G/B5G wireless modules, novel printable “ramp” interconnects and cavities for IC embedding as well as printable structures for autonomous self-diagnostic and anti-counterfeiting packaging and sensing features. The presented approach could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and “rugged” packaging. Prof. Tentzeris will discuss issues concerning the power sources of “near-perpetual” RF modules, including state-of-the-art flexible miniaturized enhanced-output and enhanced-range ambient energy harvesters up to above 5G mm-wave frequencies. The final step of the presentation will involve examples from shape-changing 4D-printed (origami) packages, reflectarrays and mm-wave wearable (eg bio-monitoring) antennas and RF modules. Special attention will be paid to the integration of ultrabroadband (Gb/sec) inkjet-printed nanotechnology-based backscattering communication modules as well as miniaturized printable wireless (eg CNT) sensors for Internet of Things (IoT), 5G and smart agriculture/biomonitoring applications. It has to be noted that the talk will review and present challenges for inkjet-printed organic active and nonlinear devices as well as future directions in the area of environmentally-friendly (“green”) RF electronics and “smart-skin” conformal sensors.