High Density Integration/Multi-Function Assemblies, Photonics, and mm-Wave Components
There are several challenges for efficient, high performance and compact integration of high frequency multi-function assemblies and modules. These challenges include active technology RF performance, interposer and board in-plane X-Y connectivity, 3D Z-connectivity and heterogeneous integration interfaces and techniques, thermal and mechanical stability, overall reliability and radiation hardness. In particular these challenges are exacerbated in high frequency electronic steering arrays (ESAs) where the area available for each element is constrained by lambda/2 spacing limitations. In this session we will discuss these and other key important topics for the space industry.