Workshops

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Bahar Jalali Farahani, Mahdi Parvizi
Cisco
705/707/709/711
Abstract

According to the latest report by Global Market Insights Inc. the market valuation of optical communication and networking will cross $30 billion by 2027. The significant revenue comes from the emerging technologies such as IoT (Internet of things), machine-to-machine networks, AI, cloud-based services, and web-based applications. Several innovations are underway to enhance the wireline and optical transceiver designs so that they can serve the increase in demand and future generations of applications.

Technical Papers
Abstract
WSK-1: Market Forces and Network Evolution
Martin Zirngibl
Macom
Materials
workshops-2022/WSK_1.pdf
Abstract
WSK-2: Advancements in High-Speed Packaging
Clint Schow
Univ. of California, Santa Barbara
Materials
workshops-2022/WSK_2.pdf
Abstract
WSK-3: Architecting Wireline Transceivers for Beyond 1Tbps Applications
Tony Chan Carusone
Univ. of Toronto
Materials
workshops-2022/WSK_3.pdf
Abstract
WSK-4: Coherent vs PAM-4 Optics in the Data Center
Alexander Rylyakov
Nokia
Materials
workshops-2022/WSK_4.pdf
Abstract
WSK-5: Towards Tb/s Coherent Silicon Photonic Links
Sudip Shekhar
Univ. of British Columbia
Materials
workshops-2022/WSK_5.pdf
Alexandre Giry, Jennifer Kitchen
CEA-LETI, Arizona State Univ.
702/704/706
Abstract

Increasing demand for high data rates, reduced latency, and increased device density are driving the development of 5G wireless systems. 5G spectrum is presently covering sub-7GHz (FR1) and mm-wave bands (FR2, FR3,…). This workshop will bring together experts from academia and industry to highlight recent works and performance trends related to 5G-FR1 Power Amplifiers (PAs) and Front-End Modules (FEMs). Multiband and high linearity requirements, along with the need for higher power and reduced power consumption, make the design of 5G-FR1 PA and FEM highly challenging and critical to overall system performance. Recent trends in Doherty, class F/F-1, multi-stage PAs, and Envelope Tracking PA architectures will be highlighted and insights into different design techniques and integration technologies (CMOS, SOI, GaN) will be presented as pathways to enable the integration of future PAs and FEMs. An introduction to emerging heterogeneous technologies combining high-power GaN with CMOS will also provide the attendees with new directions for next-generation PA design and integration.

Technical Papers
Abstract
WSM-1: Power Amplifier Circuit Techniques for 4/5G Mobile Phone Terminals
Satoshi Tanaka
Murata Manufacturing
Materials
workshops-2022/WSM_1.pdf
Abstract
WSM-2: An Overview of Envelope Tracking PAs and Hybrid Supply Modulators in CMOS Technologies
Jennifer Kitchen
Arizona State Univ.
Materials
workshops-2022/WSM_2.pdf
Abstract
WSM-3: Hybrid Architectures and Technologies for Load-Modulated Power Amplifiers
Ayssar Serhan
CEA-LETI
Materials
workshops-2022/WSM_3.pdf
Abstract
WSM-4: Heterogeneous GaN and RFSOI Technology: Device and Circuits
Gregory U'Ren
X-FAB
Materials
workshops-2022/WSM_4.pdf
Abstract
WSM-5: RF Power Amplifier Architectures to Support Cellular Infrastructure for 5G and Beyond
Joseph Staudinger, Maruf Ahmed
NXP Semiconductors, NXP Semiconductors
Materials
workshops-2022/WSM_5.pdf
Antoine Frappé, François Rivet, Fred Lee
IEMN (UMR 8520), IMS (UMR 5218), Twenty/Twenty Therapeutics
708/710/712
Abstract

The human body is a new playground for wireless communications to connect health devices or open new services related to information exchange or security. It faces many constraints such as power consumption, quality of service, reliability, and of course being compatible with the human body. The last decade has seen several innovations that exploit the body as a medium to propagate the information efficiently. This workshop proposes a state-of-the-art of up-to-date research on the topic. It starts with an overview of body area networks and pioneering research on communications and power delivery through the body. It is followed by recent developments on broadband human-body communication transceivers for wearable health monitoring. Then, surface-wave capacitive body-coupled communications are introduced and challenges for upper layers and synchronization of nodes are addressed. Finally, intra-body communications using ultrasounds are explored to complete the scope of this workshop.

Technical Papers
Abstract
WSO-1: Body Area Network — Connecting and Powering Things Together Around the Human Body
Jerald Yoo
NUS
Materials
workshops-2022/WSO_1.pdf
Abstract
WSO-2: Secure and Efficient Internet of Bodies using Body as a ‘Wire’
Shreyas Sen
Purdue Univ.
Materials
workshops-2022/WSO_2.pdf
Abstract
WSO-3: Capacitive Body-Coupled Communications and Heartbeat-Based MAC Protocol for the Human Intranet
Guillaume Tochou
STMicroelectronics
Materials
workshops-2022/WSO_3.pdf
Abstract
WSO-4: How About Other Waves for Intra Body Communication? Ultrasound Maybe?
Wim Dehaene
KU Leuven
Materials
workshops-2022/WSO_4.pdf

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Subhanshu Gupta, Renyuan Wang, Gernot Hueber
Washington State Univ., BAE Systems, Silicon Austria Labs
109/111
Abstract

Wireless networks have fueled socio-economic growth worldwide and are expected to further advance to enable new applications such as autonomous vehicles, virtual/augmented-reality, and smart cities. Due to shortage of sub-6GHz spectrum, mm-wave frequencies play an important role in the emerging 6G and the communication-on-the-move applications. Given that the propagation loss in the lower mm-wave band needs to be compensated by antenna array gain and densification of base stations with cell radius as small as a hundred meters, radio chipsets need to be power and cost efficient. To make radio chipsets power and cost efficient, state-of-the-art mm-wave-net transceivers are designed with phased antenna array (PAA). As a consequence, signal processing techniques and network protocols for mm-wave-nets are designed under constraints of PAA architectures. Future generations of mm-wave-nets will operate in the upper mm-wave frequency band where more than 10GHz bandwidth can be used to meet the ever-increasing demands. Their realization will demand addressing a completely new set of challenges including wider bandwidths, larger antenna array size, and higher cell density. These new system requirements demand fundamental rethinking of radio architectures, signal processing and networking protocols. Major breakthroughs are thus required in radio front-end architectures to enable coherent combining of wideband mm-wave spectrum, as most commonly adopted PAA-based radios face many challenges in achieving fast beam training, interference suppression, and wideband data communication. Through this workshop, we will look at the fundamental issue of coherent signal combination at these large scales from sub-GHz to sub-THz enabled by a diverse group of speakers with expertise spanning circuits, architecture, algorithms, and applications. The coherent combination will bring out true-time-delay array architectures including recent developments in wideband delay compensation methods with large range-to-resolution ratios. The delay compensation at different points of the receiver chain including RF, baseband, and digital will empower not only traditional wireless communications but also spatial signal processing for direction finding and interference suppression.

Technical Papers
Abstract
WSA-1: Key Developments in Low-Cost, Wide-Beam Scanning Phased Arrays for Mobile Airborne Communications
Julio Navarro
Boeing
Materials
workshops-2022/WSA_1.pdf
Abstract
WSA-2: A Phased Array Perspective on the Importance of True Digital Time Delay for Wide Bandwidth Systems
Andrew Rogers
Northrop Grumman
Materials
workshops-2022/WSA_2.pdf
Abstract
WSA-3: Wideband mm-Wave Beam Training with True-Time-Delay Array Architectures
Danijela Cabric
Univ. of California, Los Angeles
Materials
workshops-2022/WSA_3.pdf
Abstract
WSA-4: Overview of TTD from Electrical Optical to Acoustic Domain
Hossein Hashemi
Univ. of Southern California
Materials
workshops-2022/WSA_4.pdf
Abstract
WSA-5: Wideband Digital True-Time-Delay Compensation Techniques for Digital Arrays
Michael P. Flynn
Univ. of Michigan
Materials
workshops-2022/WSA_5.pdf
Abstract
WSA-6: Beamforming for Large, Wideband Phased Arrays: Advanced True-Time Delay and Associated Digital Control Implementations
Alberto Valdes-Garcia
IBM
Materials
workshops-2022/WSA_6.pdf
Abstract
WSA-7: Circuits and Architectures for Multi-Gb/s mm-Wave and sub-THz Wireless Transceivers in FinFET CMOS
Stefano Pellerano
Intel
Materials
workshops-2022/WSA_7.pdf
Abstract
WSA-8: Front-End Architectures for 100Gbps and More at sub-THz Frequencies
Jose-Luis Gonzalez-Jimenez
CEA-LETI
Materials
workshops-2022/WSA_8.pdf
Nuno Borges Carvalho, Alessandra Costanzo
Instituto de Telecomunicações, Univ. of Bologna
102/ 104/ 106
Abstract

5G and future 6G wireless communications have an objective to massively deploy IoT sensors everywhere; this is important for smart cities, health sensors, space exploration and so on. In this workshop the combination of wireless power transmission, wireless communications and energy harvesting will be presented with clear applications in several use cases. Academics around the world and industry will be presenting their latest developments.

Technical Papers
Abstract
WSB-1: Zero-Power Flexible Wireless Modules and Additively Manufactured Electronics for IoT, SmartAg and Smart Cities Ultra-Broadband Applications
Manos M. Tentzeris
Georgia Tech
Materials
workshops-2022/WSB_1.pdf
Abstract
WSB-2: Rectifier Design Challenges Towards Beyond 5G/6G Implementation
Kenjiro Nishikawa
Kagoshima Univ.
Materials
workshops-2022/WSB_2.pdf
Abstract
WSB-3: Latest Advances in High-Performance SWIPT Combined with Backscattering
Dominique Schreurs
KU Leuven
Materials
workshops-2022/WSB_3.pdf
Abstract
WSB-4: Towards a SWIPT Distributed Network Based on WPT and Backscatter Solution
Nuno Borges Carvalho
Instituto de Telecomunicações
Materials
workshops-2022/WSB_4.pdf
Abstract
WSB-5: From Frequency Domain to Time Domain Multiplexing-Based SWIPT
Valentina Palazzi, Luca Roselli
Università di Perugia, Università di Perugia
Materials
workshops-2022/WSB_5.pdf
Abstract
WSB-6: Near-and-Far Field Solution for Energy Autonomous Communication
Alessandra Costanzo
Univ. of Bologna
Materials
workshops-2022/WSB_6.pdf
Abstract
WSB-7: A New SWIPT System for Structural Health Monitoring of Civil Engineering Structures
Alex Takacs, Daniela Dragomirescu
LAAS-CNRS, LAAS-CNRS
Materials
workshops-2022/WSB_7.pdf
Abbas Omar, Raafat R. Mansour, Ke Wu
OvG Universität Magdeburg, Univ. of Waterloo, Polytechnique Montréal
108/110
Abstract

Utilizing mm-waves in mobile communications has been known to be associated with much lower radiation powers and much shorter communication ranges. This has given rise to what are called “Microcells” and “Picocells”, whose coverage areas do not exceed a few meters. These cells are responsible for the communication with the User Equipment (UE). Their backhaul communications with high-power Base Stations (BS) are either wired (usually fiber-optical) or in a Line-of-Sight (LOS) scenario. LOS wireless communications do not involve wave-matter interactions, as any LOS obstacle heavily deteriorates the communication quality. Health aspects of 5G and beyond is therefore limited to the extremely low-power short-range Picocell-UE communication. Another related relevant aspect is the very strong mm-wave attenuation in water-rich substances characterizing biological tissues. mm-Waves cannot therefore penetrate into biological objects (eg human and animal bodies and plants) more than few millimeters. Health aspects must therefore be investigated within the skin area. Deeper inside the body, mm-waves assume negligible intensities, which are much safer than those of earlier standards (eg 3G and 4G). A group of very competent scientists will talk at this workshop. These represent standardization institutions, academic scientists involved in health issues of electromagnetic radiations, and physicists, who can qualitatively estimate the in-vivo radiation levels and the electromagnetic loss mechanisms dominating the wave-matter interactions in biological substances. The expected results should be very calming for the public, as it will be shown that the major standards (eg ICNIRP, IEEE, and ANSI) allow for harmless radiation levels, and this has been justified by the long-time experience with man-made radiation in the last decades (broadcasting and different wireless communication modalities). It will also be shown that social-media widely-spread views of pseudoscience and conspiracy theorists claiming serious health hazards, which are caused generally by mm-wave radiation and particularly as related to 5G and beyond, are clearly BASELESS. To a great extent, these claims are based on mixing up ionizing and nonionizing radiation. The mechanisms of wave-matter interactions in the latter are fully described by the constitutive parameters: permittivity, permeability, and conductivity for weak and moderate field intensities that do not involve nonlinearities. These are macroscopic quantities (spatial moving averages) that average out spatial microscopic details. The averaging window is at most a few hundredths of wavelength wide. Possible changes in critical and sensitive atomic or molecular structures (similar to that existing in eg DNA or nerve cells) cannot considerably exceed the macroscopic average. The latter is a reversible thermal one, as long as the radiated power levels do not exceed those dictated by the Regulatory Agencies (eg FCC in USA).

Technical Papers
Abstract
WSC-1: Wave-Matter Interaction at mm-Wave Frequencies
Abbas Omar
OvG Universität Magdeburg
Materials
workshops-2022/WSC_1.pdf
Abstract
WSC-2: This is Your Brain on 5G
Peter Siegel, David Gultekin
Caltech, Columbia Univ.
Materials
workshops-2022/WSC_2.pdf
Abstract
WSC-3: Evaluation of the Impact of RF Electromagnetic Waves on Cells with Near-Field Exposure Instrumentations
Katia Grenier
LAAS-CNRS
Materials
workshops-2022/WSC_3.pdf
Abstract
WSC-4: RF Exposure Levels from Mobile Phones and Base Stations
C-K Chou
C-K. Chou Consulting
Materials
workshops/WSC_4.pdf
Abstract
WSC-5: New Challenges Related to 5G Bioelectromagnetic Exposure for Laboratories Studies
Delia Arnaud-Cormos, Rosa Orlacchio, Philippe Leveque
XLIM (UMR 7252), XLIM (UMR 7252), XLIM (UMR 7252)
Materials
workshops-2022/WSC_5.pdf
Abstract
WSC-6: RF Exposure Limits: Evolution and Current Issues
Ken Foster
Univ. of Pennsylvania
Materials
workshops-2022/WSC_6.pdf
Abstract
WSC-7: Behavioral studies of pollinator interaction with 5G range electromagnetic radiation
Chris Palego
Bangor Univ.
Materials
workshops-2022/WSC_7.pdf
Abstract
WSC-8: Health Aspects of 5G Antennas: current low-level evidences and experimental design strategies
Sandra Costanzo
Univ. of Calabria
Materials
workshops-2022/WSC_8.pdf
Didier Belot, Wolfgang Heinrich
CEA-LETI, FBH
201/203
Abstract

Telecom communities are beginning to prepare the next generation of mobile telecom, the 6G, and present KPIs going to the Tbps, 300GHz carrier frequency, space multiplexing, spectrum agility, dense Massive MIMO, wide bands, and so forth. Serving these challenges, microelectronics communities must re-think their medium term roadmap: what role can CMOS processes play? Is SiGe HBT a good answer to these KPIs? Do we need more exotic technologies such as III-V HBT or HEMT? How to do Heterogeneous Integrations, in a 3D approach? How to integrate antennas and passives?

Technical Papers
Abstract
WSD-1: Toward 6G: From New Hardware Design to Wireless Semantic and Goal-Oriented Communication Paradigms
Emilio Calvanese Strinati
CEA-LETI
Materials
workshops-2022/WSD_1.pdf
Abstract
WSD-2: Technology Challenges for 6G
Nadine Collaert, Piet Wambacq
IMEC, IMEC
Materials
workshops-2022/WSD_2.pdf
Abstract
WSD-3: Advanced 200mm and 300mm RF SOI and BiCMOS Technologies Targeting 5G and Beyond (6G) RF Front-End Module SOC
Frederic Gianesello
STMicroelectronics
Materials
workshops-2022/WSD_3.pdf
Abstract
WSD-4: SiGe HBT for mm-Wave and THz Applications
Mohamed Hussein Eissa
IHP
Materials
workshops-2022/WSD_4.pdf
Abstract
WSD-5: 2.5D and 3D Integrations for mm-Wave and THz Applications
Tanja Braun
Fraunhofer IZM
Materials
workshops-2022/WSD_5.pdf
Abstract
WSD-6: FinFET CMOS for mm-Wave Applications
Stefano Pellerano, Said Rami
Intel, Intel
Materials
workshops-2022/WSD_6.pdf
Abstract
WSD-7: InP HBT for mm-Wave and THz Applications
Wolfgang Heinrich
FBH
Materials
workshops-2022/WSD_7.pdf
Abstract
WSD-8: 100nm to 40nm GaN-on-Si for mm-Wave Application
Remy Leblanc
OMMIC
Materials
workshops-2022/WSD_8.pdf
Abstract
WSD-9: InGaAs mHEMTs: Technology and Circuit Aspects for mm-Wave and THz Applications
Fabian Thome
Fraunhofer IAF
Materials
workshops-2022/WSD_9.pdf
Abstract
WSD-10: A Technology-Design Roadmap Addressing 300GHz Connectivity
Baudouin Martineau
CEA-LETI
Materials
workshops-2022/WSD_10.pdf
Steven Callender, Sungwon Chung
Intel, Neuralink
205/207
Abstract

The Power Amplifier (PA) continues to be a critical building block in mm-wave communication systems, often dictating the overall system efficiency and can thereby impose constraints on system deployment (eg max phased-array size due to thermal constraints). As such, many publications focus on efficiency enhancement techniques for mm-wave power amplifiers. However, when used in systems targeting “5G and Beyond” applications, transceiver bandwidths must be suitable to meet the high data-rate specifications, and hence, maximum PA efficiency cannot be blindly pursued. Instead, efficiency enhancement techniques must be explored in close consideration of their implications on bandwidth which is what this workshop aims to explore more deeply. The goal of this workshop is three-fold: 1) familiarize the audience with PA specifications required for next-gen applications, 2) review well-known (and emerging) efficiency enhancement techniques for mm-wave PAs with perspectives on attainable bandwidth, and 3) discuss techniques to enhance bandwidth while maintaining adequate efficiency required for practical systems. The workshop features talks which will highlight PA specifications for two of the forefront “5G and Beyond” applications — radar and large-scale phased-arrays — covering the 20–100+ GHz, along with reference designs suitable for such applications. In addition, there will discussion on design methodologies for maximizing bandwidth while optimizing efficiency in the context of mm-wave and sub-THz linear amplifiers and mm-wave Doherty amplifiers. Lastly, an emerging efficiency enhancement technique, the sub-harmonic switching amplifier, will also be presented.

Technical Papers
Abstract
WSE-1: Broadband, Back-Off Efficient, and VSWR Resilient mm-Wave PA Architectures Across 30–100+ GHz in CMOS/SiGe/InP
Kaushik Sengupta, Zheng Liu
Princeton Univ., Princeton Univ.
Materials
workshops-2022/WSE_1.pdf
Abstract
WSE-2: Design of mm-Wave Power Amplifiers for Radar Applications in CMOS and SiGe HBT Technologies
Vadim Issakov, Vincent Lammert, Sascha Breun
Technische Univ. Braunschweig, Infineon Technologies, FAU Erlangen-Nürnberg
Materials
workshops-2022/WSE_2.pdf
Abstract
WSE-3: mm-Wave CMOS Power Amplifiers for 5G Base Station Applications
Hyun-Chul Park, Jooseok Lee, Joonho Jung, Seungjae Baek, Taewan Kim, Sung-Gi Yang
Samsung, Samsung, Samsung, Samsung, Samsung, Samsung
Materials
workshops-2022/WSE_3.pdf
Abstract
WSE-4: mm-Wave CMOS PAs for 5G Handsets
Sherif Shakib, Jeremy Dunworth, Vladimir Aparin
Qualcomm, Qualcomm, Qualcomm
Materials
workshops-2022/WSE_4.pdf
Abstract
WSE-5: High Efficiency D-Band Multi-Way Power Combined Amplifiers in 45nm CMOS RFSOI
Siwei Li, Gabriel M. Rebeiz
Univ. of California, San Diego, Univ. of California, San Diego
Materials
workshops-2022/WSE_5.pdf
Abstract
WSE-6: Broadband mm-Wave PA Design in Advanced FinFET CMOS
Steven Callender, Ritesh Bhat
Intel, Intel
Materials
workshops-2022/WSE_6.pdf
Abstract
WSE-7: mm-Wave Doherty PA with Bandwidth Enhancement Techniques for 5G and Beyond
Fei Wang
Georgia Institute of Technology
Materials
workshops-2022/WSE_7.pdf
Abstract
WSE-8: Subharmonic Switching 5G PAs for Efficiency Enhancement
Aoyang Zhang
Harvard Univ.
Materials
workshops-2022/WSE_8.pdf
Alirio Boaventura, Michael Hamilton
NIST, Auburn Univ.
401-402
Abstract

Quantum computers hold the promise to perform certain complex calculations that are not solvable even with today’s most powerful supercomputers. But despite the significant progress made in the last decade in the science and engineering of quantum computation systems, several challenges remain to be overcome before quantum computation can become practically usable. A key challenge relates to system scalability — fault-tolerant quantum computation will likely require thousands or millions of quantum bits (qubits), far beyond the capacity of current prototypes. Today’s most prominent candidate for implementing large-scale systems, the superconducting qubit platform, operates in the microwave regime and is controlled and readout via conventional microwave electronics operating at room temperature. While the current room temperature control and readout approach works for small-scale experiments, it is not scalable to thousands or millions of qubits. The engineering challenges of realizing practical large-scale systems present quantum microwave engineers with new opportunities in microwave modeling, design, and characterization of cryogenic semiconductor and superconductor devices, circuits, and systems. This workshop will address emerging techniques and technologies for quantum information processing including low-temperature measurements and calibrations, cryogenic packaging and interconnects, monolithic semiconductor-based quantum processors, and quantum-classical interfaces based on cryogenic CMOS and Josephson superconductive electronics.

Technical Papers
Abstract
WSF-1: Cryo-CMOS Systems and Circuits for Large-Scale Quantum Computers
Fabio Sebastiano
Technische Universiteit Delft
Materials
workshops-2022/WSF_1.pdf
Abstract
WSF-2: Packaging and Interconnect Challenges for Cryogenic and Quantum Systems
Michael Hamilton
Auburn Univ.
Materials
workshops-2022/WSF_2.pdf
Abstract
WSF-3: Josephson Junction Based Control Electronics for Superconducting Qubits
Adam Sirois
NIST
Materials
workshops-2022/WSF_3.pdf
Abstract
WSF-4: Cryogenic Microwave Measurement and Characterization Approaches for Communications and Quantum Information
Alirio Boaventura
NIST
Materials
workshops-2022/WSF_4.pdf
Abstract
WSF-5: Towards Automated Microwave Measurements and Calibrations at Millikelvin Temperatures
Rich Chamberlin, Elyse McEntee Wei
NIST, NIST
Materials
workshops-2022/WSF_5.pdf
Abstract
WSF-6: Application of a VNA for Measurement of Superconducting Microwave Resonators
Suren Singh
Keysight Technologies
Materials
workshops-2022/WSF_6.pdf
Abstract
WSF-7: Developing S-Parameter Measurement Setups for Characterizing Superconducting Qubit Circuits at mK Temperatures
Kyle Thompson
Maybell Quantum Industries
Materials
workshops-2022/WSF_7.pdf
Abstract
WSF-8: Towards Millions of Qubits in a Quantum SoC
Robert Bogdan Staszewski, Imran Bashir, Elena Blokhina
Univ. College Dublin, Equal1 Labs, Univ. College Dublin
Materials
workshops-2022/WSF_8.pdf
Hsieh-Hung Hsieh, Tim LaRocca, Qun Jane Gu
TSMC, Northrop Grumman, Univ. of California, Davis
403-404
Abstract

With recent 5G deployment underway, the focus of wireless research is shifting toward 6G, which is expected to have a peak data rate of 1Tb/s and air latency less than 100 microseconds, 50 times the peak data rate and one-tenth the latency of 5G. To achieve Tb/s transmissions in 6G, it is inevitable to utilize the frequency band over 100GHz or sub-THz due to enormous amount of available bandwidth. However, the use of such high frequency bands results in more design challenges of RF circuits including output power, noise, linearity, signal conversion, and high-quality signal source for 6G communications and sensing. In addition, the optimal phased array architecture needs to be carefully analyzed such that the compact and energy-efficient system package can be attained. Moreover, to compensate for the severe mm-wave or sub-THz path loss, a large number of phased array is required to enhance EIRP and SNR while appropriate designs are necessary to establish reliable wireless links and ensure the array performance. Failure in any of these will prevent us from moving forward regarding the development of 6G. In this workshop, the main theme to be discussed concentrates on mm-wave design challenges and solutions for 6G wireless communications, especially targeting RF circuits. The workshop starts with an overview of mm-wave 6G to illustrate the whole picture to the audience. Afterwards, the RF design challenges based on silicon technologies to realize 6G systems are paid more attention while the innovative design techniques are provided such that the advantages of low cost and high-level integration in silicon can be still obtained. For in-depth exploration, being a critical building block in RF front-ends, mm-wave and sub-THz PA is specially under discussion to investigate the design bottlenecks as well as technology limitations, and the potential solutions and technology directions are presented. Besides RF designs, the analysis of phased-array architecture suitable for 6G applications is mentioned while the analog and digital beamforming structures are compared. In this workshop, to overcome the hurdles arising from silicon technologies, a new silicon-compatible III-V technology is introduced to facilitate 6G RF front-end designs. This workshop also covers the mm-wave and sub-THz communication and sensing systems from the top-down perspective for the comprehensive demonstration of 6G realization.

Technical Papers
Abstract
WSG-1: Overview of mm-Wave 6G: Opportunities and Challenges
Gary Xu
Samsung
Materials
workshops-2022/WSG_1.pdf
WSG-2: Energy-efficiency in Power Amplifiers and Transmitters for Digital Beamforming Arrays above 100 GHz
James Buckwalter
Univ. of California, Santa Barbara
Materials
workshops-2022/WSG_2.pdf
Abstract
WSG-3: Practical Approaches to Industrializing Near-THz Communication Systems
Shahriar Shahramian
Nokia Bell Labs
Materials
workshops-2022/WSG_3.pdf
Abstract
WSG-4: mm-Wave RF Transceiver Designs Over 100GHz for 6G Wireless Communications
Kenichi Okada
Tokyo Tech
Materials
workshops-2022/WSG_4.pdf
Abstract
WSG-5: mm-Wave PA Design Challenges and Solutions for 6G Applications
Hua Wang
ETH Zürich
Materials
workshops-2022/WSG_5.pdf
Abstract
WSG-6: Next-Generation Phased Arrays for 6G mm-Wave Wireless Communications
Siwei Li, Gabriel M. Rebeiz
Univ. of California, San Diego, Univ. of California, San Diego
Materials
workshops-2022/WSG_6.pdf
Abstract
WSG-7: Joint 3D Sensing and Communication at mm-Wave
Arun Paidimarri
IBM T.J. Watson Research Center
Materials
workshops-2022/WSG_7.pdf
Abstract
WSG-8: Heterogeneous III-V/CMOS Technologies for Beyond-5G and 6G Solutions to RF Front-End Circuits
Nadine Collaert
IMEC
Materials
workshops-2022/WSG_8.pdf
Vadim Issakov, Omeed Momeni
Technische Univ. Braunschweig, Univ. of California, Davis
501-502
Abstract

The amount of sensing applications at mm-wave frequencies is continuously growing. Most of the applications can be addressed by classical radar techniques, but not all. Additional types of novel energy efficient sensing concepts for near-field imaging arrays and spectroscopy are being investigated. This full-day workshop covers near-field sensing and advanced state of the art radar techniques at mm-wave and THz frequencies. The intention is to showcase the unique applications and innovative concepts for sensing different materials and parameters including vital signs, small motions and distances, permittivity, humidity and gas density, and biomolecules using mm-wave to THz frequencies. The first half of the workshop will focus on various solutions for mm-wave and THz imaging and spectroscopy. For example, real-time THz super-resolution near-field imaging will be discussed, as well as transceivers at THz for gas spectroscopy. Advantages and disadvantages of various sensing approaches will be discussed. In the second half, we will discuss the latest trends and future directions in mm-wave radar systems. We will focus specifically on novel mm-wave radar modulation schemes, advanced system and circuit realizations. The emphasis is on digital radar modulation techniques, such as OFDM, PMCW, spread-spectrum, and their advantages or disadvantages versus classical FMCW radar realizations. The main idea of the workshop is to give an overview on mm-wave and THz sensing concepts and show the future directions for the advanced mm-wave radar radar transceivers.

Technical Papers
Abstract
WSH-1: Towards High-Angular-Resolution Radar Imaging at Sub-THz
Ruonan Han
MIT
Materials
workshops-2022/WSH_1.pdf
Abstract
WSH-2: An Integrated-Circuit Approach to THz Bio-Medical Applications
Ullrich R. Pfeiffer
Bergische Universität Wuppertal
Materials
workshops-2022/WSH_2.pdf
Abstract
WSH-3: RFIC design challenges dealing with mm-wave massive MIMO radars
Nadav Mazor, P Svalänge
Vayyar Imaging, Vayyar Imaging
Materials
workshops-2022/WSH_3.pdf
Abstract
WSH-4: Fully Integrated FMCW Radars: Devices to Systems
Ehsan Afshari
Univ. of Michigan
Materials
workshops/WSH_4.pdf
Abstract
WSH-5: Advanced Digital Modulation Schemes for mm-Wave Radar Systems
Thomas Zwick
KIT
Materials
workshops-2022/WSH_5.pdf
Abstract
WSH-6: Highly-Integrated PMCW and FMCW Radar Systems on Chip in CMOS
Ilja Ocket
IMEC
Materials
workshops-2022/WSH_6.pdf
Abstract
WSH-7: System-Level Considerations on mm-Wave Radar for Proximity Sensing
Vincent Lammert, Matteo Bassi
Infineon Technologies, Infineon Technologies
Materials
workshops-2022/WSH_7.pdf
Alyosha Molnar, Harish Krishnaswamy, Jin Zhou
Cornell Univ., Columbia Univ., Univ. of Illinois at Urbana-Champaign
503-504
Abstract

Modern transceivers often rely on many discrete components, such as SAW and BAW filters and duplexers, to protect them from interference. The number of these discrete front-end components is expected to grow further as more bands are made available at RF and mm-wave frequencies, limiting the system cost, form factor and flexibility. Also, while integrated self-interference cancellation has been demonstrated, many challenges remain at the antenna interface and scaling to phased-array and MIMO transceivers. In this workshop, experts from academic and industry will present the state-of-the-art interference mitigation approaches that can be applied to integrated wireless transceivers. Finally, the workshop will conclude with an interactive panel discussion about the potential and limitations of integrated interference mitigation.

Technical Papers
Abstract
WSI-1: Introduction to RF and mm-Wave Interference Mitigation (Past Work and Future Directions)
Alyosha Molnar
Cornell Univ.
Materials
workshops-2022/WSI_1.pdf
Abstract
WSI-2: Multi-Blocker-Tolerant Passive MIMO Receivers
Ramesh Harjani
Univ. of Minnesota
Materials
workshops-2022/WSI_2.pdf
Abstract
WSI-3: Passive-Mixer-First Acoustic-Filtering Superheterodyne RF Front-Ends
Jin Zhou
Univ. of Illinois at Urbana-Champaign
Materials
workshops-2022/WSI_3.pdf
Abstract
WSI-4: Integrated Non-Reciprocal Components: Design, Applications and Future Directions
Aravind Nagulu
Washington Univ. in St. Louis
Materials
workshops-2022/WSI_4.pdf
Abstract
WSI-5: Multi-Antenna Full-Duplex Receivers
Mahmood Dastjerdi
MiXComm
Materials
workshops-2022/WSI_5.pdf
Abstract
WSI-6: Transceiver Techniques for FDD and Full-Duplex Wireless
Emanuel Cohen
Technion
Materials
workshops-2022/WSI_6.pdf
Abstract
WSI-7: Time-Approximation Filter for Direct RF Transmitter
Shiyu Su, Shuo-Wei Chen
Univ. of Southern California, Univ. of Southern California
Materials
workshops-2022/WSI_7.pdf
Abstract
WSI-8: Mitigation of Reciprocal Mixing Caused by Phase Noise and Spurs in Wideband RF Receivers
Hao Wu
Broadcom
Materials
workshops-2022/WSI_8.pdf
Raja Pullela, Oren Eliezer, Travis Forbes
MaxLinear, Ambiq, Sandia National Laboratories
605/607
Abstract

This workshop will walk you through the steps involved in designing today’s complex radios for applications such as infrastructure cellular, Wi-Fi or mm-wave beam forming arrays from a systems perspective. The workshop caters to students, as well as experienced engineers in the industry, with background in RF systems, circuit design or standards, who are interested in expanding the scope of their knowledge beyond the narrow design tasks they may be exposed to. Attendees will learn how system specifications are derived, how we partition design between RF/Analog/Mixed-signal and digital sections to achieve the most optimum solution in terms of size, power, external BOM. You will hear from speakers who are experts in their areas: a mix from industry and academia. Standards related specification and product level requirements that drive architecture or topology choices will be presented. Using Wi-Fi 802.11be emerging standard as an example, we will outline the salient features and how they compare with previous generations. We will address design considerations imposed by the new standard requirements, with particular focus on RF. Presentations focused on base station cellular transceivers will illustrate the differences between narrow-band (mixer-based) and Direct Sampling/Synthesis approaches. Using microwave and mm-wave point to point communication systems, we will go over design aspects such as line-up analysis to arrive at block level specifications. We will present transmit/receive circuit/system challenges in large-scale arrays, followed by approaches towards realizing scalable, digital-intensive large-scale arrays. Design advances in critical building blocks, such as blocker tolerant receivers and ADPLLs will also be discussed. We will present built-in self-calibration techniques and built-in mitigation of self-interference, leading to reduced production testing costs and high production yields. Calibration techniques to overcome impairments such as IQ error or LO offset calibration and Digital Pre-Distortion (DPD) for linearization of power amplifiers will be discussed.

Technical Papers
Abstract
WSJ-1: Design Considerations for Radios for Cellular Infrastructure
David McLaurin
Analog Devices
Materials
workshops-2022/WSJ_1.pdf
Abstract
WSJ-2: Wireless Point to Point Communication System Design Considerations
Vamsi Paidi
MaxLinear
Materials
workshops-2022/WSJ_2.pdf
Abstract
WSJ-3: Design Considerations for Direct RF Sampling and Synthesis Wideband Radios
Gabriele Manganaro
MediaTek
Materials
workshops-2022/WSJ_3.pdf
Abstract
WSJ-4: Recent Trends in Low-Power Low-Jitter Digital Phase-Locked Loops
Teerachot Siriburanon
Univ. College Dublin
Materials
workshops-2022/WSJ_4.pdf
Abstract
WSJ-5: Design Considerations for Next-Generation Wi-Fi Standards
Sigurd Schelstraete
MaxLinear
Materials
workshops/WSJ_5.pdf
Abstract
WSJ-6: Beamforming and MIMO Transceivers for Communication and Radar Systems
Arun Natarajan
Oregon State Univ.
Materials
workshops/WSJ_6.pdf
Abstract
WSJ-7: Receiver Design Techniques to Maintain Sensitivity in the Presence of Large Blockers
Travis Forbes
Sandia National Laboratories
Materials
workshops/WSJ_7.pdf
Abstract
WSJ-8: Design for Manufacturability in High-Volume Extensively Digital RF Transceivers
Oren Eliezer
Ambiq
Materials
workshops-2022/WSJ_8.pdf

-

Rocco Tam, Yao-Hong Liu
NXP Semiconductors, IMEC
705/707/709/711
Abstract

Wireless proximity communication provides many unique features over conventional wireless communication such as ultra-high data rate, superior data privacy, energy efficiency, mechanical reliability, precision ranging and bandwidth density. However, those unique features always come with many design trade-offs in system complexity, effective communication distance, energy efficiency and system robustness. In this workshop, we are going to go over several wireless proximity communication techniques such as Mid-Field powering and communication for bio-medical implants, impulse ultra-wide-band and mm-wave. The first and second workshops will introduce the applications in latest UWB standard (IEEE 802.15.4z), and the design trade off in commercial UWB SoC system and circuit design. The third workshop will focus on Mid-Field technology for powering and communication with biomedical neuromodulation implants. This technology offers advantages such as significantly smaller, implanted deeper, implant complexity, patient complication and post-surgical pain. The last work workshop presents the overview of solid-state-based mm-wave wireless interconnects from fundamental research to commercialization.

Technical Papers
Abstract
WSL-1: Energy-Efficient IEEE 802.15.4z IR-UWB Transceiver Design
Minyoung Song
Holst Centre
Materials
workshops-2022/WSL_1.pdf
Abstract
WSL-2: Ultra-Wide Band Technology, New Era, New Use Cases
Babak Vakili-Amini, Henrik Jensen, Jan van Sinderen, Rozi Roufoogaran
NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors
Materials
workshops-2022/WSL_2.pdf
Abstract
WSL-3: Mid-Field Technology for Biomedical Neuromodulation Implantable System
Alexander Yeh
NeuSpera Medical
Materials
workshops-2022/WSL_3.pdf
Abstract
WSL-4: mm-Wave Contactless Connectors: From Fundamental Research to Commercialization
Yanghyo Kim
Stevens Institute of Technology
Materials
workshops-2022/WSL_4.pdf
Xun Luo, Debopriyo Chowdhury
UESTC, Broadcom
702/704/706
Abstract

The power amplifiers (PA) and transmitters are the last door in the RF front-end for both the digital and analog kingdoms, one which greatly affects the quality of service (QoS) of the wireless link for modern RF communication, such as 5G, IoT, and beyond. Due to the multi-function trends nowadays, this workshop will showcase the digitally intensive PAs and transmitters, which attract much attention due to their highly reconfigurable nature and rapid development that is on pace with the decreasing scale of CMOS technology. In the first talk, with the aim to powering the next generation of wireless communication, from RF to mm-wave, a series of switched capacitor power amplifiers are discussed. Then, CMOS digital power amplifier and transmitter for efficient signal amplification and beam steering are introduced in the second talk. Next, in the third talk, the all digital transmitter with GaN switching mode power amplifiers with high power efficiency is discussed. Later, digital polar transmitter for impulse-radio ultrawide band communication is introduced in the fourth talk. Finally, the high-performance digital-to-analog converter design towards a digital transmitter is discussed in the fifth talk.

Technical Papers
Abstract
WSN-1: Switched Capacitor Power Amplifiers: Powering the Next Generation of Wireless Communication, from RF to mm-Wave
Jeffrey Walling
Virginia Tech
Materials
workshops-2022/WSN_1.pdf
Abstract
WSN-2: All Digital Transmitter with GaN Switching Mode Power Amplifiers
Rui Ma
MERL
Materials
workshops-2022/WSN_2.pdf
Abstract
WSN-3: CMOS Digital Power Amplifier and Transmitter for Efficient Signal Amplification and Beam Steering
Huizhen Jenny Qian
UESTC
Materials
workshops-2022/WSN_3.pdf
Abstract
WSN-4: Digitally Intensive Power Amplifier Based Transmitter for Ultra-Low Power RF Communication
Minyoung Song
Holst Centre
Materials
workshops-2022/WSN_4.pdf
Abstract
WSN-5: High-Performance Digital-to-Analog Converter Design Towards A Digital Transmitter
Mike Shuo-Wei Chen
Univ. of Southern California
Materials
workshops-2022/WSN_5.pdf

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Charles Baylis, Albin J. Gasiewski, Dimitrios Peroulis
Baylor Univ., University of Colorado Boulder, Purdue Univ.
505-507
Abstract

Passive, scientific microwave systems perform crucial functions: providing early warning to massive populations to protect from hurricanes, winter storms, and other natural disasters, and enabling scientific understanding of astronomical phenomena. The recent addition of fifth-generation (5G) wireless into mm-wave spectral bands near those designated for these sensitive scientific observations, and expected future expansion of wireless communications to additional, higher-frequency bands, has jeopardized the fidelity of these sensing operations due to interference. However, wireless communications connects societies across the globe, and is a key driver of global economic stimulation, and as such must continue to expand while ensuring scientific measurements can continue. This workshop will overview both this challenge and new solutions at the microwave circuit and system levels to provide coexistence between active and passive spectrum-use systems. The workshop begins with specific discussions of a roadmap for developing coexistence between passive scientific and 5G wireless systems from the National Science Foundation and European Space Agency, challenges faced by passive systems, and perspectives from the commercial wireless industry. With this background, the next talks highlight microwave circuit and systems innovations that form promising solutions to this problem, including reconfigurable circuit design for 5G wireless systems, artificially intelligent power amplifier arrays, and a spectral broker for coordination between active and passive spectrum systems. The workshop will conclude with a panel session for extensive audience interaction with all speakers.

Technical Papers
Abstract
WMJ-1: Introduction and Audience Poll of Topical Interest
Materials
workshops-2022/WMJ_1.pdf
Abstract
WMJ-2: Protecting Science: Roadmap for Coexistence Between Passive Scientific Systems and Wireless Communications
Ashley VanderLey
National Science Foundation
Materials
workshops-2022/WMJ_2.pdf
Abstract
WMJ-3: The European Space Agency’s Experience on the Coexistence between Passive and Active Applications
Yan Soldo
ESA-ESTEC
Materials
workshops-2022/WMJ_3.pdf
Abstract
WMJ-4: Potential Technology Models for Active-Passive Coexistence
Albin J. Gasiewski
University of Colorado Boulder
Materials
workshops-2022/WMJ_4.pdf
Abstract
WMJ-5: Extension of Commercial Shared Spectrum Frameworks to Passive/Active Coexistence
Andrew Clegg
Google
Materials
workshops-2022/WMJ_5.pdf
Abstract
WMJ-6: Reconfigurable Circuit Design and Load Modulation Techniques for 5G Coexistence with Weather Radiometry
Dimitrios Peroulis, Kenle Chen
Purdue Univ., Univ. of Central Florida
Materials
workshops-2022/WMJ_6.pdf
Abstract
WMJ-7: Spectral/Spatial Broker and Array Impedance Tuning for Real-Time Active/Passive System Spectral Coexistence
Charles Baylis, Sarah Seguin
Baylor Univ., Baylor Univ.
Materials
workshops-2022/WMJ_7.pdf
Abstract
WMJ-8: Panel Session: The Way Forward
Materials
workshops-2022/WMJ_8.pdf
Jon Kraft
Analog Devices
705/707/ 709/711
Abstract

Phased array communications and radar systems are finding increased use in a variety of applications. This places a greater importance on training engineers and rapidly prototyping new phased array concepts. However, both those imperatives have historically been difficult and expensive. But a recent open source offering, the ADALM-PHASER, allows real beamforming hardware to be used for education, project proposals, and product development. This workshop will introduce that offering with lectures and hands on labs covering: software defined radio (SDR), phased array beamforming (steering angle and beam formation), antenna impairments (side lobes/tapering, grating lobes, beam squint, quantization sidelobes), Monopulse tracking implementation, and simple radar algorithm design. Each of these topics will be addressed with a short lecture, followed by the participants using the ADALM-PHASER hardware to directly explore the lecture topic.

Technical Papers
Abstract
WMM-1: Introduction to Phased Array Hardware Design and Frequency Planning
Matthew Pierce
Ball Aerospace
Materials
workshops-2022/WMM_1.pdf
Abstract
WMM-2: SDR and System Level Control
Robin Getz
Analog Devices
Materials
workshops-2022/WMM_2.pdf
Abstract
WMM-3: Phased Array Beam Formation
Laila Fighera Marzall
University of Colorado Boulder
Materials
workshops-2022/WMM_3.pdf
Abstract
WMM-4: Antenna Impairments in Phased Array Systems
Bob Broughton
Analog Devices
Materials
workshops-2022/WMM_4.pdf
Abstract
WMM-5: Hybrid Beamformer and Monopulse Tracking
Peter Moschetti, Brad Allen
Lockheed Martin, Lockheed Martin
Materials
workshops-2022/WMM_5.pdf
Abstract
WMM-6: Introduction to Phased Array Radar Design and Algorithms
Peter Delos
Analog Devices
Materials
workshops-2022/WMM_6.pdf
Changzhan Gu, Pingshan Wang, Perry Li, Jessi Johnson
SJTU, Clemson Univ., Abbott, Altruem Consulting
708/710/ 712
Abstract

Systems that utilize RF, microwave and mm-wave energy are becoming increasingly important in the commercial medical device world. In the design of new medical devices, the use of high-frequency electromagnetics must be considered. For example, an implant such as a pacemaker should not require surgically-based battery replacement, but should be wirelessly rechargeable. A neurostimulator should be configurable and controllable by a phone or tablet. A vital sign sensor should allow for non-contact measurements to maximize comfort and usability. Wearable medical sensors should stream data wirelessly to a central location for display and analysis by medical professionals. These examples are just a few of the reasons why RF, microwave and mm-wave devices are of increasing importance and can be routinely found in government approved medical devices around the world. As RF, microwave and mm-wave technology rapidly advances in the academic and commercial environment, it will continue to be adapted toward medical applications in new and interesting ways. Please join our panel of industry experts for an interactive discussion about the in-roads that high-frequency approaches have made in the medical device space. Example applications include high-power RF/microwave ablation for cancer and cardiac applications, radar-based vital-sign sensing, in-body or on-body communication systems, wireless-power techniques, and cell detection and characterization. Panelists will share their perspective on both the current state-of-the-art, as well as future applications of this invaluable technology. In addition to technical content, unique considerations for the industry such as clinical study development, the regulatory approval process and the marketing of medical devices will be discussed.

Technical Papers
Abstract
WMO-1: RF Innovations in Design of Next Generation Medical Devices
Anil Kumar RamRakhyani
Verily
Materials
workshops-2022/WMO_1.pdf
Abstract
WMO-2: mm-Wave Radars for Healthcare Monitoring
Xinen Zhu
SGR Semiconductors
Materials
workshops-2022/WMO_2.pdf
Abstract
WMO-3: Wearable Sensors
Eric Chow
Abbott
Materials
workshops-2022/WMO_3.pdf
Abstract
WMO-4: Changing the Cancer Treatment Pathway using Microwave and RF Energy
Chris Hancock
Creo Medical
Materials
workshops-2022/WMO_4.pdf
Abstract
WMO-5: Modeling RF and Microwave Energy Absorption in Biological Tissue
Arlen Ward
System Insight Engineering

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Dimitra Psychogiou, Roberto Gómez-García, Michael Höft
Univ. College Cork, Universidad de Alcalá, CAU
109/111
Abstract

This workshop will focus on recent advances in emerging manufacturing and integration processes for 3D microwave and mm-wave RF filters for the next generation of wireless and satellite communication systems. In particular, the workshop will present new RF design and electromagnetic modeling techniques for new classes of RF filtering components (bandpass/bandstop filters, multi-band filters and multiplexers) based on well-established manufacturing processes such as CNC machining and Si-based microfabrication that enables the realization of RF filters from mm-waves to frequencies in the sub-THz region (eg 700GHz). Furthermore, the workshop will provide an overview of emerging digital additive manufacturing processes such as stereolithography, selective laser sintering for new types of materials such as ceramics, plastics and metals and their application to advanced RF filtering architectures. The potential of these processes for complex geometries as well as for RF filters with advanced RF performance, high-frequency of operation, small form factor and low weight will be discussed in detail. Lastly, the workshop will present new RF design methodologies and novel RF filtering architectures that are uniquely enabled by the manufacturing flexibility of 3D printing that facilitates the realization of unconventional shapes.

Technical Papers
Abstract
WMA-1: Advanced and Adaptive Waveguide Filter Configurations for W-Band and Beyond
Chad Bartlett, Daniel Miek, Michael Höft
CAU, CAU, CAU
Materials
workshops-2022/WMA_1.pdf
Abstract
WMA-2: Recent Development in AFSIW Filtering and Passive Components Toward Advanced Systems on Substrates
Anthony Ghiotto
IMS (UMR 5218)
Materials
workshops-2022/WMA_2.pdf
Abstract
WMA-3: Silicon Micromachining Enabling High-Q Filter Solutions from D-Band to THz Frequencies
Joachim Oberhammer
KTH
Materials
workshops-2022/WMA_3.pdf
Abstract
WMA-4: Waveguide-Based Filtering Components Using New Manufacturing Techniques
Oilid Bouzekri, Yi Wang
European Space Agency, Univ. of Birmingham
Materials
workshops-2022/WMA_4.pdf
Abstract
WMA-5: Additive Manufacturing Processes in Ceramic and Metal for the Fabrication of RF Filters
Reinhard Teschl
Technische Universität Graz
Materials
workshops-2022/WMA_5.pdf
Abstract
WMA-6: Advanced Ceramics and Manufacturing Technologies Applied to 3D Filters
Nicolas Delhote
XLIM (UMR 7252)
Materials
workshops-2022/WMA_6.pdf
Abstract
WMA-7: Monolithic Integration Concepts for Highly-Versatile and Highly-Miniaturized Coaxial RF Filters Enabled by SLA 3D Printing
Dimitra Psychogiou
Univ. College Cork
Materials
workshops-2022/WMA_7.pdf
WMA-8: Compact Realizations of Advanced Filter Responses in Planar and 3D Waveguide Technologies
A. Sharma, E. Messaoudi, V. Boria, J. Martinez, Santiago Cogollos, M. Guglielmi
Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València, Univ. Politècnica de València
Materials
workshops/WMA_8.pdf
Abstract
WMA-9: How to Exploit the High Flexibility of Additive Manufacturing in Filter Design
Cristiano Tommassoni
Università di Perugia
Materials
workshops-2022/WMA_9.pdf
Abstract
WMA-10: Shape Deformation as a Tool for Miniaturization of 3D Printed Microwave Filters
Adam Lamecki, Michał Mrozowski
Gdansk University of Technology, Gdansk University of Technology
Materials
workshops-2022/WMA_10.pdf
Gabriel M. Rebeiz
Univ. of California, San Diego
102/104/106
Abstract

There has been a tremendous advance in satellite communications in the past 3 years. First, Starlink (LEO) has sent upwards of 1600 satellites and is now building 5000 user terminals A WEEK (all based on phased-arrays), OneWeb (LEO) has secured $5B of funding and has sent 400 satellites and will be ready for operation in December 2021, Amazon Kuiper is building their LEO constellation as we speak, SES with mPower and their 2000-beam phased-arrays in a MEO constellation can now provide 500 Mbps to thousands of ISP (internet service providers) at the same time, and Viasat and HNS have both launched their GEO Tbps satellites each with 300+ beams. All of these units require advanced phased-arrays on the ground for user terminals and SATCOM-On-the-Move. This workshop will address advances in these low-cost ground terminals and in the LEO/MEO/GEO constellations, and will present the silicon technologies needed for this work.

Technical Papers
Abstract
WMB-1: High Performance Silicon Beamformers for Next Generation Satcom Internet Connectivity
Tumay Kanar
Renesas Electronics
Materials
workshops-2022/WMB_1.pdf
Abstract
WMB-2: Electronically Scanned Arrays in SATCOM Systems
Matt Little
Ball Aerospace
Materials
workshops-2022/WMB_2.pdf
Abstract
WMB-3: Bits in Space: Delivering Connectivity to the Next 4B Subscribers
Alex Margomenos
GLOBALFOUNDRIES
Materials
workshops-2022/WMB_3.pdf
Abstract
WMB-4: Foundry Technologies for Satcom and Emerging Commercial Wireless
David Howard
Tower Semiconductor
Materials
workshops-2022/WMB_4.pdf
Abstract
WMB-5: High Performance Ku and Ka Band SATCOM Phased Arrays for LEO, MEO and GEO Terminals
Gokhan Gultepe
Extreme Waves
Materials
workshops-2022/WMB_5.pdf
Abstract
WMB-6: Ka-Band AESA for Satellite Communications — Development and Challenges for Low SWaP-C
Hiroyuki Joba, Takahashi Tomohiro
Mitsubishi Electric, Mitsubishi Electric Corp.
Materials
workshops-2022/WMB_6.pdf
Abstract
WMB-7: Next Generation Satellite Systems — Opportunities and Challenges
Mu Li
Hughes Network Systems, LLC
Materials
workshops-2022/WMB_7.pdf
Abstract
WMB-8: High Performance Active Phased Arrays for MEO constellations: Challenges and Opportunities
Ashok Rao
SES
Materials
workshops-2022/WMB_8.pdf
Abstract
WMB-11: Project Kuiper Technology
Nima Mahanfar
Amazon
Materials
workshops-2022/WMB_11.pdf
Abstract
WMB-12: Ubiquitous Mobile Connectivity Through Commercial SATCOM
Julio Navarro
Boeing
Materials
workshops-2022/WMB_12.pdf
Abstract
WMB-13: Enabling Phased Arrays in Space
John Cowles
Analog Devices
Materials
workshops-2022/WMB_13.pdf
Tejinder Singh, Gwendolyn Hummel, Atif Shamim
Dell Technologies, Sandia National Laboratories, KAUST
108/110
Abstract

The extremely crowded and rapidly changing modern spectral environment has significantly increased the demand for highly reconfigurable RF technologies of high performance and small size. While RF switches are key elements in modern wireless communications and defense applications, switch performance has been stagnant for the last decade. With 5G being rapidly implemented and 6G on the horizon, RF systems are moving to the mm-wave bands and the RF loss in fundamental elements such as switches is becoming even more critical. Many commercially available switch technologies have certain issues with at least one of the following: resistive load, capacitive interference, limited bandwidth, low power operation, and/or nonlinearity. Recent work on emerging chalcogenide phase change material (PCM)-based switches has demonstrated a breakthrough innovation and a new class of reconfigurable devices exhibiting high performance, better monolithic and heterogeneous integration capabilities with other switch technologies, exceptional figure of merit, and broadband RF response compared to various commercially available switch technologies. Along with PCMs, metal-insulator transition (MIT) material such as vanadium dioxide based devices have also gained significant interest and researchers around the globe have demonstrated various interesting applications using PCM/MIT including but not limited to tunable mm-wave components, reconfigurable electro-optical components, and resonant sensors. Several research groups and industries are working to mature these technologies for high performance and efficient future wireless systems. This workshop aims to trigger the discussion on emerging PCM/MIT technologies regarding recent innovations, challenges, integration possibilities, limitations, and future trends.

Technical Papers
Abstract
WMC-1: Chalcogenide-Based Phase-Change Material RF Switches: Fundamentals, Design Considerations, and Circuit/System Applications
Nabil El-Hinnawy
Tower Semiconductor
Materials
workshops-2022/WMC_1.pdf
Abstract
WMC-2: Phase Change Materials (PCM) Switches and their Microwave and mm-Wave Applications
Raafat R. Mansour
Univ. of Waterloo
Materials
workshops-2022/WMC_2.pdf
Abstract
WMC-3: Design and Optimization of Phase Change Material-Based Switches and Circuits
Pierre Blondy
XLIM (UMR 7252)
Materials
workshops-2022/WMC_3.pdf
Abstract
WMC-4: Robust SbTe-Based Phase Change RF Switch Technology
Jeong-sun Moon
HRL Laboratories
Materials
workshops-2022/WMC_4.pdf
Abstract
WMC-5: Spiking and Resonant RF Sensors Based on Vanadium Dioxide
Adrian Mahai Ionescu
EPFL
Materials
workshops-2022/WMC_5.pdf
Abstract
WMC-6: TaOx Resistive Switching Phenomena; Physical Properties and Device Applications
Robin B. Jacobs-Gedrim
Sandia National Laboratories
Materials
workshops-2022/WMC_6.pdf
Abstract
WMC-7: Vanadium Dioxide for Reconfigurable Antennas and Microwave Devices: Enabling RF Reconfigurability Through Smart Materials
Dimitris E. Anagnostou
Heriot-Watt Univ.
Materials
workshops-2022/WMC_7.pdf
Abstract
WMC-8: Phase Change Electro-Optical Components
Mina Rais-Zadeh
Jet Propulsion Lab
Materials
workshops-2022/WMC_8.pdf
Kevin Xiaoxiong Gu, Kamal Samanta
Metawave, Sony
201/203
Abstract

Research and development on mm-wave front-end implementations are expanding to a new frontier beyond 100GHz for emerging 6G communication and radar imaging applications. This proposed workshop covers the latest advancement of packaging and integration technologies for designing and implementing >100GHz front-end modules including in-depth discussions of different substrates, interconnects, antennas, co-design with RFICs, thermal management, system demos/prototypes, and so on. We plan to have 11 experts (5 from university/research institutes; 6 from industry) to present their pioneering works in this area: (1) Prof. Mark Rodwell from UCSB and Director of the SRC/DARPA ComSenTer Wireless Research Center, (2) Dr. Muhammad Furqan from Infineon, (3) Siddhartha Sinha from imec, (4) Dr. Telesphor Kamgaing from Intel, (5) Dr. Alberto Valdes-Garcia from IBM Research, (6) Prof. Wolfgang Heinrich from the Ferdinand-Braun-Institut (FBH), (7) Dr. Augusto Gutierrez-Aitken from Northrop Grumman, (8) Dr. Jon Hacker from Teledyne, (9) Dr. Goutam Chattopadhyay from NASA JPL, (10) Prof. Emmanouil (Manos) M. Tentzeris from Georgia Tech, and (11) Dr. Venkatesh Srinivasan from Texas Instruments.

Technical Papers
Abstract
WMD-1: 140, 210, and 280GHz IC and Transceiver Module Design
Mark Rodwell
Univ. of California, Santa Barbara
Materials
workshops-2022/WMD_1.pdf
Abstract
WMD-3: Hetero-Integration as a Key Enabler for Sub-THz Radar and Communication Systems
Siddhartha Sinha
IMEC
Materials
workshops-2022/WMD_3.pdf
Abstract
WMD-4: Silicon and Organic Packaging Integration for mm-Wave and Sub-THz Communications
Telesphor Kamgaing
Intel
Materials
workshops-2022/WMD_4.pdf
Abstract
WMD-5: Scaled W-Band Phased Array Module Design and Integration for Real-Time 3D Radar Imaging
Alberto Valdes-Garcia
IBM
Materials
workshops-2022/WMD_5.pdf
Abstract
WMD-6: InP-on-BiCMOS Hetero-Integration for 100GHz and Beyond
Wolfgang Heinrich
FBH
Materials
workshops-2022/WMD_6.pdf
Abstract
WMD-7: Heterogeneous Integration for High Frequency RF Applications
Augusto Gutierrez-Aitken
Northrop Grumman
Materials
workshops-2022/WMD_7.pdf
Abstract
WMD-8: Wafer-Scale mm-Wave Integration Techniques for Phased Arrays
Jon Hacker
Teledyne Scientific & Imaging
Materials
workshops-2022/WMD_8.pdf
Abstract
WMD-9: Integration and Packaging for Systems at mm-Wave and THz Frequencies
Goutam Chattopadhyay
Jet Propulsion Lab
Materials
workshops-2022/WMD_9.pdf
Abstract
WMD-10: Additively manufactured Reconfigurable Intelligent Surfaces for B5G/6G Sub-GHz Applications
Manos M. Tentzeris
Georgia Tech
Materials
workshops-2022/WMD_10.pdf
Abstract
WMD-11: Package Design at mm-Wave Frequencies for Radar Transceivers: Challenges and Opportunities
Venkatesh Srinivasan
Texas Instruments
Materials
workshops-2022/WMD_11.pdf
Kenneth E. Kolodziej, Timothy M. Hancock
MIT Lincoln Laboratory, DARPA
205/207
Abstract

Many wireless systems could benefit from the ability to transmit and receive on the same frequency at the same time, which is known as in-band full-duplex (IBFD) and/or simultaneous transmit and receive (STAR). As this area matures, research is shifting towards reducing device form factors and creating novel self-interference cancellation techniques along with completely-integrated IBFD transceivers. In this workshop, experts from industry, academic and federal research institutions will discuss the various approaches that can be taken to construct IBFD systems and devices in an integrated fashion. Additionally, a mini-panel session is planned where the workshop speakers will debate the answers to questions posed by attendees for an interactive discussion with the audience.

Technical Papers
Abstract
WME-1: In-Band Full-Duplex Overview and Integration Challenges
Kenneth E. Kolodziej, Timothy M. Hancock
MIT Lincoln Laboratory, DARPA
Materials
workshops-2022/WME_1.pdf
Abstract
WME-2: Disaggregated Platform-Based Approach for In-Band Full Duplex Systems
Mayank Jain, Aditya Agrawal
Kumu Networks, Kumu Networks
Materials
workshops-2022/WME_2.pdf
Abstract
WME-3: Applications of Code-Domain Signal Processing for Full-Duplex Radio
James F. Buckwalter
Univ. of California, Santa Barbara
Materials
workshops-2022/WME_3.pdf
Abstract
WME-4: Hybrid Time-Domain/Frequency-Domain Self-Interference Cancellation for STAR Applications
Mark Hickle
BAE Systems
Materials
workshops-2022/WME_4.pdf
Abstract
WME-5: In-Band, Full-Duplex Self-Interference Mitigation Under Realistic Hardware Constraints
Alyosha C. Molnar, David G. Landon, Daniel W. Bliss
Cornell Univ., L3Harris, Arizona State Univ.
Materials
workshops-2022/WME_5.pdf
Abstract
WME-6: Wideband Photonic-Acoustic Assisted Self-Interference Cancellation for Full-Duplex Transceivers
Firooz Aflatouni
Univ. of Pennsylvania
Materials
workshops-2022/WME_6.pdf
Abstract
WME-7: Revolutionizing STAR Transceivers through Electric + Acoustic SIC
Harish Krishnaswamy
Columbia Univ.
Materials
workshops-2022/WME_7.pdf
Abstract
WME-8: MMIC Components for Broadband STAR Arrays
Laila Marzall
University of Colorado Boulder
Materials
workshops-2022/WME_8.pdf
Abstract
WME-9: GHz to Sub-THz In-Band Full-Duplex Operations in CMOS Based on Wave Frequency and Mode Conversions
Ruonan Han
MIT
Materials
workshops-2022/WME_9.pdf
Joseph Bardin, Fabio Sebastiano
Google, Technische Universiteit Delft
401-402
Abstract

Microwave techniques are central to many modern quantum computing and quantum sensing platforms, ranging from those implemented with superconducting circuits to those relying on trapped ions. For instance, in superconducting technologies, qubits are implemented using nonlinear microwave resonators — which sometimes are frequency tunable — and coupling between qubits is often mediated using tunable LC filter networks. The state of a superconducting quantum processor is controlled using microwave signaling and measured using microwave reflectometry. Similarly, spin-qubit and trapped-ion systems often rely heavily on microwave signaling for their operation. As the culmination of decades of research, quantum computers can now perform certain classes of computations that are impractical using classical supercomputers. While today’s quantum computers have largely been enabled by advances in commercial microwave technology, the quest to build these machines has also led to pioneering research that has pushed the limits of microwave amplification, packaging, filtering, and system design. In this workshop, leading researchers will describe progress in microwave technologies as applied to quantum computing and quantum sensing. The workshop is both broad and deep, covering microwave technologies that are used across the quantum computing landscape. At the high level, researchers will describe how microwave techniques are used to control superconducting, spin, and trapped-ion based quantum processors, covering a wide array of topics ranging from how microwave fields can be used in the trapping and manipulation of single ions to modular and SoC-based control systems for next-generation superconducting and spin qubit based quantum computers. The workshop will also contain deep dives into areas such as the systematic design of near-quantum-limited microwave parametric amplifiers, superconducting interconnect and filtering networks, system level quantum-coherent microwave packaging techniques, the cryogenic noise limits of semiconductor amplifiers, and quantum sensor systems leveraging microwave techniques. Central to all talks is the connection between microwave technology and the quantum information sciences.

Technical Papers
Abstract
WMF-1: Microwave and RF Techniques in Trapped Ion Quantum Computing
Daniel Slichter
NIST
Materials
workshops-2022/WMF_2.pdf
Abstract
WMF-2: Design of Microwave Control Systems for Emerging NISQ-Scale Quantum Computers
Glenn Jones
Rigetti Computing
Abstract
WMF-3: Systematic Design of Microwave Parametric Amplifiers, Frequency Converters, and Circulators
Ofer Naaman
Google
Materials
workshops-2022/WMF_3.pdf
Abstract
WMF-4: A Fully Integrated Cryo-CMOS SoC for a Scalable Quantum Computer Implemented in Intel 22nm FFL FinFET Process
Sushil Subramanian
Intel Corp.
Materials
workshops-2022/WMF_4.pdf
Abstract
WMF-5: WITHDRAWN - Quantum I/O for the KQbit Era: Integrating Cryogenic Microwave Components in a Flexible Stripline
Kiefer James Vermeulen
Delft Circuits
Abstract
WMF-6: 3D Integration and Cryogenic Packaging for Superconducting Qubits
Mollie Schwartz
MIT Lincoln Laboratory
Abstract
WMF-7: Microwave Readout of Solid-State Quantum Sensors
David Phillips
Massachusetts Institute of Technology
Materials
workshops-2022/WMF_7.pdf
Abstract
WMF-8: Towards the Lower Limits of Microwave Noise in HEMTs: Self-Heating and Real-Space Transfer
Austin Minnich
Caltech
Materials
workshops-2022/WMF_8.pdf
Roberto Quaglia, Olof Bengtsson
Cardiff University, FBH
403-404
Abstract

Power amplifiers for high frequency applications can benefit greatly from the ability to dynamically vary the supply voltage. For example, when spectral efficient signals are used, their large amplitude dynamic generally requires a compromise between linearity and efficiency of the amplifier, leading to poor average efficiency. By applying supply modulation in the form of envelope tracking, the average efficiency can be enhanced significantly. The introduction of GaN technology has enabled highly efficient very fast switch-based supply modulators that are required for the very large instantaneous bandwidth in telecommunication for space and the future 5G systems. With the introductions of 5G the system frequency increase and power per PA is reduced by distributed PA solutions like MIMO. The same is true for space applications but here, the main motivation for the development of efficient solid-state solutions is the transfer from bulky tube based solutions. The large instantaneous bandwidth of the future telecom systems poses a challenge for dynamic supply modulation but the high frequency and reduced power allows for novel integrated solutions with reduced parasitic effects where the modulator and RFPA are integrated on the same chip. This workshop will: introduce the motivations and applications of supply modulation technologies for space and terrestrial telecommunication; discuss how RF transistor technologies affect the requirements of the supply modulator and the effectiveness of supply modulation; show advanced design techniques for the supply modulator and the integration with RF amplifier; present system level solutions including linearization of supply modulation-based amplifier systems. Moreover, two expert talks on supply modulation for dynamic power control in high power ISM systems is also considered and optimized, compact envelope tracking for 3D printers will enable cross-fertilization with fields adjacent to the microwave industry and permit a fruitful exchange of ideas.    

The organizer’s aim is to actively involve the audience in the discussion, in order to provide them with a useful experience. For this reason, an online quiz will involve the audience with questions that can be answered only by interacting with the speakers.

Technical Papers
Abstract
WMG-1: Supply modulated PAs: promises and challenges
Roberto Quaglia, Olof Bengtsson
Cardiff University, Cardiff University
Materials
workshops-2022/WMG_1.pdf
Abstract
WMG-2: Supply-Modulated Power Amplifier Systems for 5G and Space
Olof Bengtsson, Sophie Paul, Christoph Schulze, Nikolai Wolff
FBH, FBH, FBH, FBH
Materials
workshops-2022/WMG_2.pdf
Abstract
WMG-3: Supply Modulation Techniques for High PAPR Signals
Gregor Lasser, Maxwell Duffy, Connor Nogales, Paul Flaten, Zoya Popovic
Ferdinand-Braun-Institut, Northrop Grumman, University of Colorado Boulder, Northrop Grumman, Univ. of Colorado
Materials
workshops-2022/WMG_3.pdf
Abstract
WMG-4: Linearization Techniques for Wideband Envelope Tracking Systems for Handsets
Pere Gilabert, Wantao Li, Gabriel Montoro
Univ. Politècnica de Catalunya, Univ. Politècnica de Catalunya, Univ. Politècnica de Catalunya
Materials
workshops-2022/WMG_4.pdf
Abstract
WMG-5: Assessing High Frequency Transistor Technologies for Envelope Tracking Systems
Alexander Alt, Jonathan Lees, Peng Chen, Paul Tasker
Cardiff University, Cardiff University, Cardiff University, Cardiff University
Materials
workshops-2022/WMG_5.pdf
WMG-6: 8-Level Envelope-Tracking with Power-DAC and RF Amplifier Architectures
Tommaso Cappello, Zoya Popovic
Univ. of Bristol, Univ. of Colorado
Materials
workshops-2022/WMG_6.pdf
Abstract
WMG-7: Fast DC/DC Modulator Using a Single Stage Buck Converter
Riccardo Tinivella
Brusa Elektronik
Materials
workshops-2022/WMG_7.pdf
Abstract
WMG-8: Design Considerations for High Power VHF Amplifiers for Transient and Dynamic Loads
Florian Maier
TRUMPF Hüttinger
Materials
workshops-2022/WMG_8.pdf
Ko-Tao Lee, Guillaume Callet
Qorvo, UMS
503-504
Abstract

Recent advances of the GaN/GaAs technology development have enabled RF module switching at extremely high frequency that Si devices cannot withstand. It has shaped the landscape of RF industry and enabled applications in mm-wave frequency bands. In this full-day workshop, 9 talks will be presented from highly-recognized industrial leaders and technical experts across the globe. It covers the the major breakthrough from the latest development of GaN/GaAs technology and integration, including 1) heterogeneous integration of GaN/GaAs MMIC, 2) exploratory RF devices for mm-wave, and 3) systems and use-cases of GaN/GaAs technologies. At the closing of the day, an interactive panel session will be conducted between speakers and audiences. It is expected that the workshop can provide a platform for the latest mm-wave technology breakthroughs and a forum to share views.

Technical Papers
Abstract
WMI-1: Emerging mm-Wave Device and Integration Technology — Next Generation GaN and Beyond
Thomas Kazior
DARPA
Materials
workshops-2022/WMI_1.pdf
Abstract
WMI-2: mm-Wave Scalable Unconstrained Broadband Arrays (MMW SCUBA)
Ryan Walsh
Northrop Grumman
Materials
workshops-2022/WMI_2.pdf
Abstract
WMI-3: Advanced Interconnects for Heterogeneous Integration of GaN and GaAs RF MMICs
Deep Dumka
Qorvo
Materials
workshops-2022/WMI_3.pdf
Abstract
WMI-4: mm-Wave GaN MMICs for 5G and Satellite Communication Systems
Koji Yamanaka
Mitsubishi Electric
Materials
workshops-2022/WMI_4.pdf
Abstract
WMI-5: MMIC and Integration Technologies for Best-In-Class mm-Wave Component Solutions from 24GHz up to E-Band
Laurent Marechal
UMS
Materials
workshops-2022/WMI_5.pdf
Abstract
WMI-6: Compound Technologies Advancement for mm-Wave Applications — from a Commercial Foundry Perspective
Barry Lin
Wavetek
Materials
workshops-2022/WMI_6.pdf
Abstract
WMI-7: Research and Development of GaN-Based HEMTs for mm-Wave and THz Wireless Communications
Issei Watanabe
NICT
Materials
workshops-2022/WMI_7.pdf
Abstract
WMI-8: GaN Integration in FOWLP
Michael Pretl
Rohde & Schwarz
Materials
workshops-2022/WMI_8.pdf
Abstract
WMI-9: Integrated Compound Semiconductor Circuits — a 6G Communications Systems Perspective
Kristoffer Andersson
Ericsson
Materials
workshops-2022/WMI_9.pdf
Xiaobang Shang, Nick Ridler, Jian Ding, Andy Tucker
NPL, Spirit Semiconductor, Filtronic Broadband Ltd.
605/607
Abstract

Accurate on-wafer S-parameter measurement plays an important role in the development of mm-wave integrated circuits for communications and electronics applications. To this end, a group of international experts in this field will share their experience on making reliable on-wafer measurements at high frequencies (eg above 100GHz). The presenters come from different backgrounds — instrumentation manufacturers, metrology institutes, end-users in industry and academia — and so provide different perspectives on this topic. The emphasis of the workshop is on sharing practical tips (ie good practice) so that attendees can subsequently implement such methods in their own workplaces. The workshop will cover topics including calibration techniques, verification methods, guides on design of custom calibration standards, instrumentation, and applications, etc. The workshop includes two panel discussions: (i) an open discussion about the challenges/opportunities/outlooks for research into on-wafer measurements in coming years; and (ii) an opportunity for attendees to describe their own on-wafer measurement problems so that these can be discussed, and hopefully solved, during the workshop.

Technical Papers
Abstract
WMK-1: Review of Calibration Techniques for On-Wafer Measurements at mm-Wave Frequencies
Xiaobang Shang, Nick Ridler
NPL, NPL
Materials
workshops-2022/WMK_1.pdf
Abstract
WMK-2: Wafer-Level RF Measurement System Integrity: How to Verify and When and Why we have to do it
Andrej Rumiantsev, Ralf Doerner
MPI, FBH
Materials
workshops-2022/WMK_2.pdf
Abstract
WMK-3: Guidelines for Performing Accurate On-Wafer Measurements Including the Suppression of Parasitic Effects
Uwe Arz, Gia Ngoc Phung
PTB, PTB
Materials
workshops-2022/WMK_3.pdf
Abstract
WMK-4: Modeling and Correction of Probe-Probe Crosstalk at mm-Wave Frequencies
Chong Li
Univ. of Glasgow
Materials
workshops-2022/WMK_4.pdf
Abstract
WMK-5: Open Discussion 1: On-Wafer Measurement: Challenges and Opportunities for the Future
Abstract
WMK-6: Instrumentation Aspects of mm-Wave On-Wafer Measurements
Jon Martens
Anritsu
Materials
workshops-2022/WMK_6.pdf
Abstract
WMK-7: Broadband RF to mm-Wave S-Parameter Measurements for Semiconductor Transistor and IC Test
Gavin Fisher, Anthony Lord
FormFactor, FormFactor
Materials
workshops-2022/WMK_7.pdf
Abstract
WMK-8: On-Wafer Measurements and Calibration at Sub-mm-Wave Frequencies Using Micromachined Probes
Robert M. Weikle, Matthew F. Bauwens, Michael E. Cyberey, Linli Xie, N. Scott Barker, Arthur W. Lichtenberger
Univ. of Virginia, Dominion Microprobes, Univ. of Virginia, Univ. of Virginia, Univ. of Virginia, Univ. of Virginia
Materials
workshops-2022/WMK_8.pdf
Abstract
WMK-9: Combined mm-Waves and Nanorobotics for Traceable Electronics Technology
Kamel Haddadi
IEMN (UMR 8520)
Materials
workshops-2022/WMK_9.pdf
Abstract
WMK-10: Open Discussion 2: Bring Your Own Measurement Problem
Nicholas Miller, Sourabh Khandelwal
AFRL, Macquarie Univ.
702/704/ 706
Abstract

Gallium nitride (GaN) high electron mobility transistors (HEMTs) are an excellent technology for various microwave power amplifier applications due to the underlying semiconductor’s wide bandgap, high breakdown voltage and large peak electron velocity. A key bottleneck to the technology’s widespread and long-term adoption into commercial and military applications is its inherent electrical reliability. The physical mechanisms of GaN HEMT electrical degradation are largely unresolved and actively under investigation. In this full-day workshop, international experts in the fields of microwave measurements, trap characterization, thermal characterization, GaN HEMT nonlinear modeling, trap modeling, and TCAD modeling will present state-of-the-art research. 

This interactive workshop aims to inform and excite the attendees on the advances in multiple aspects of this technology. Starting with a GaN technology overview, the planned talks will inform the audience into measurement and characterization of this technology including the charge trapping and thermal properties in these devices. Next part of the workshop covers the modeling and simulation research in GaN. Starting with an overview of modeling challenges in GaN devices, the workshop will cover the latest industry standard compact models and advances in TCAD-based modeling of GaN devices. 

Technical Papers
Abstract
WML-1: The History of GaN electronics: A perspective
Umesh Mishra, Matthew Guidry
Univ. of California, Santa Barbara, Univ. of California, Santa Barbara
Materials
workshops-2022/WML_1.pdf
Abstract
WML-2: Measuring GaN HEMT Performance Degradation Under Nonlinear Dynamic Operation
Valeria Vadalà
Università di Milano-Bicocca
Materials
workshops-2022/WML_2.pdf
Abstract
WML-3: Experimental Characterization of Charge Trapping in GaN HEMTs using LF and RF Measurement Techniques
Gian Piero Gibiino, Alberto Maria Angelotti
Univ. of Bologna, Univ. of Bologna
Materials
workshops-2022/WML_3.pdf
Abstract
WML-4: Low Frequency Active Harmonic Load-Pull for Experimental Verification of Power Amplifiers’ Modes
Patrick Roblin, J. Apolinar Reynoso-Hernandez, Marlon Molina Ceseña
Ohio State Univ., CICESE, CICESE
Materials
workshops-2022/WML_4.pdf
Abstract
WML-5: Advanced Thermal Characterization of GaN Devices, From Micro to Nanoscale, and New Heating Sinking Solutions
Paul Hayes, Martin Kuball
QFI Corporation, Univ. of Bristol
Materials
workshops-2022/WML_5.pdf
Abstract
WML-6: Overview and Challenges of Modeling Microwave and mm-Wave GaN HEMT Technologies
Rob Jones
BAE Systems
Materials
workshops-2022/WML_6.pdf
Abstract
WML-7: Device and Circuit Co-Design Using MVSG Modeling Framework
Ujwal Radhakrishna
Texas Instruments
Materials
workshops-2022/WML_7.pdf
Abstract
WML-8: Scalable Nonlinear RF Modeling of GaN HEMTs with Industry Standard ASM HEMT Compact Model
Sourabh Khandelwal
Macquarie Univ.
Materials
workshops-2022/WML_8.pdf
Abstract
WML-9: Nonlinear RF modeling of GaN HEMTs with Fermi kinetics transport and the ASM-HEMT compact model
Nicholas Miller, Matt Grupen
AFRL, AFRL
Materials
workshops-2022/WML_9.pdf
Abstract
WML-10: Prediction by Technology Computer Aided Design of the Large Signal GaN HFET Performance
Christos Zervos, Dan Ritter
Technion - Israel Institute of Technology, Technion
Materials
workshops-2022/WML_10.pdf
Abstract
WML-11: Physics-Based Large-Signal and Trap Modeling of GaN HEMTs
Petros Beleniotis, Matthias Rudolph
Brandenburg Univ. of Technology, BTU
Materials
workshops-2022/WML_11.pdf

-

Michael Schroter, Peter Zampardi
Technische Universität Dresden, Qorvo
505-507
Abstract

The focus of the workshop is to provide an overview on transistor performance limits in terms of reliably achievable RF output power of various semiconductor technologies that are presently competing for mobile radio-frequency (RF) applications such as 5G, 6G, automotive radar and imaging, operating in the mm-wave frequency range (ie 30GHz to 300GHz). Of particular interest here are power amplifiers, oscillators, Mach-Zehnder-interferometers, and all sorts of RF buffer circuits that drive transistors to their dynamic large-signal limits and are implemented in semiconductor technologies such as III-V HBTs, SiGe HBTs and FDSOI-CMOS. The presentations will explore the presently quite heterogeneous approaches for determining the transistor related safe-operating-area in terms of reliability and ruggedness for designing circuits that are supposed to deliver high output power at high frequencies in mobile applications. The workshop starts with a tutorial on the design specifications of the above mentioned circuits and the corresponding requirements for large-signal dynamic transistor operation up to the mm-wave region. Based on this motivation, several presentations will outline, for each of the technologies, the state-of-the-art of transistor characterization for RF ruggedness as well as the device physics that cause degradation and the modeling approaches for including reliability aspects in process design kits. The workshop concludes with a tutorial on existing measurements methods for large-signal device testing in the mm-wave range.

Technical Papers
Abstract
WMH-1: Mobile Large-Signal RF Circuits: Design Perspective
Nils Pohl
Ruhr-Universität Bochum
Materials
workshops-2022/WMH_1.pdf
Abstract
WMH-2: Characterizing and Modeling of Safe Operating Area for SiGe NPNs in Tower’s SBC18 Technology
Samir Chaudhry
Tower Semiconductor
Materials
workshops-2022/WMH_2.pdf
Abstract
WMH-3: Load-Pull Based RF Reliability Investigations of SiGe HBTs
Michael Schroter
Technische Universität Dresden
Materials
workshops-2022/WMH_3.pdf
Abstract
WMH-4: III-V HBT Reliability
Brian Moser
Qorvo
Materials
workshops-2022/WMH_4.pdf
Abstract
WMH-5: III-V HBT Reliability Related Device Physics
Peter Zampardi
Qorvo
Materials
workshops-2022/WMH_5.pdf
Abstract
WMH-6: 22FDX MOSFET Technology — RF/mm-Wave Reliability
Wafa Arfauoi
GLOBALFOUNDRIES
Materials
workshops-2022/WMH_6.pdf
Abstract
WMH-7: VNA-Based Large-Signal Characterization of Electronic Devices at Sub-mm-Wave Frequencies
Luca Galatro
Vertigo Technologies
Materials
workshops-2022/WMH_7.pdf
Abstract
WMH-8: Panel Discussion
Young-Kai Chen
II-VI
705/707/ 709/711
Abstract

Digital signal processing (DSP) is the critical element to adapt dynamic wireless propagation media and mitigate nature and man-made impairments. Today’s model-based DSP techniques function well in the stationary wireless channel, which can be easily disrupted by the random events such as in-band interference, noise and non-stationary fading channels. Emerging AI/ML techniques have demonstrated unique capability to capture and mitigate these corner cases. These AI/machine learning techniques can significantly enhance the processing capability better than the legacy model-banded DSP techniques. This workshop will illustrate several recent advances in AI-ML-based signal processing techniques to mitigate impairments, such as non-stationary channel fading, interference, and noise, in wireless channels to enable robust wireless communication and radar applications.

Technical Papers
Abstract
WMN-1: Neural Network OFDM Receiver Design and FPGA Implementation
Deniz Erdogmus, Bahar Azari, Nasim Soltani, Hai Cheng, Mauro Belgiovine, Yangyu Li, Haoqing Li, Tales Imbirba, Salvatore D'Oro, Yanzhi Wang, Pau Closas, Tommaso Melodia, Kaushik Chowdhury
Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ., Northeastern Univ.
Materials
workshops-2022/WMN_1.pdf
Abstract
WMN-2: Neural Network Signal Processing for LTE Receiver Application
Amit Bhatia, Josh Robinson, Joseph Carmack, John Majewski, Scott Kuzdeba, Joseph Farkas, Brandon Hombs, Tom Koch
BAE Systems, BAE Systems, BAE Systems, BAE Systems, BAE Systems, Signal Processing Technologies, Signal Processing Technologies, Signal Processing Technologies
Materials
workshops-2022/WMN_2.pdf
Abstract
WMN-3: Adversarial Deep-Unfolding Networks (ADNs) for Symbol Detection in Communication Systems
Hung Nguyen, H. Vincent Poor, Steven Bottone, Isidoros Doxas
Princeton Univ., Princeton Univ., Northrop Grumman, Northrop Grumman
Materials
workshops-2022/WMN_3.pdf
Abstract
WMN-4: Computationally Efficient AI for Extending DSP Functions in Wireless Communications and Sensing
Gil Raz, Carl Dohrman, Mark Chilenski, Ion Matei, Nicholas Destefano, Brian Donovan, Gerard Gubash
Systems & Technology Research, Systems & Technology Research, Systems & Technology Research, PARC, Systems & Technology Research, Systems & Technology Research, Systems & Technology Research
Materials
workshops-2022/WMN_4.pdf
Abstract
WMN-5: End-to-End Auto-Encoder Communications with Interference Suppression
Tugba Erpek, Kemal Davaslioglu, Yalin Sagduyu
Intelligent Automation, Intelligent Automation, Intelligent Automation
Materials
workshops-2022/WMN_5.pdf
Abstract
WMN-6: Neuro-Adaptive Query-Driven Radar Beamforming
Jeffrey Krolik, Michael Martinez, Huanrui Yang, Jingchi Zhang, Hai Li
Duke Univ., Duke Univ., Duke Univ., Duke Univ., Duke Univ.
Materials
workshops-2022/WMN_6.pdf
Abstract
WMN-7: Emerging Efficient AI/ML Processing for Edge Applications
Young-Kai Chen
II-VI
Materials
workshops-2022/WMN_7.pdf
Chris Holloway, Shane Verploegh
NIST, ColdQuanta
708/710/ 712
Abstract

In the past 10 years, there has been a great push in the development of a fundamentally new International System of Units (SI) traceable approach to electric field sensing. Atom-based measurements allow for this direct SI-traceability, and as a result, usage of Rydberg atoms (traceable through Planck’s constant) have greatly matured via measurement techniques and sensor head developments. Current Rydberg atom sensors have the capability of measuring amplitude, polarization, and phase of RF fields. Promising benefits of this quantum technology for RF receivers are the extremely large tuning range from DC fields to the submillimeter range, high selectivity in the instantaneous RF bandwidth from the nature of atomic transitions at each frequency choice, and the frequency-independent size of the sensor head. Applications of these sensors include SI-traceable E-field probes, voltage standards, power sensors, microwave radiometers, direction of arrival estimation, radar and communication receivers with amplitude, frequency, and phase modulated signal discrimination, and many others. This workshop will give an overview and summarize this new technology, discuss various applications, and pathways to commercialization.

Technical Papers
Abstract
WMP-1: An Overview of Rydberg Atom-Based Sensors
Chris Holloway
NIST
Materials
workshops-2022/WMP_1.pdf
Abstract
WMP-2: High Spectral Resolution Rydberg Atom-Based Sensing for Radio Frequency Metrology
James Shaffer
Quantum Valley Ideas Lab
Materials
workshops-2022/WMP_2.pdf
Abstract
WMP-3: Rydberg Atoms for RF Applications
David Anderson
Rydberg Technologies
Materials
workshops-2022/WMP_3.pdf
Abstract
WMP-4: Engineering Advancement Towards Integrating Rydberg Atom Systems
Shane Verploegh
ColdQuanta
Materials
workshops-2022/WMP_4.pdf
Abstract
WMP-5: Rydberg Electric Field Sensor Application Spaces
Charles Fancher
MITRE
Materials
workshops-2022/WMP_5.pdf
Abstract
WMP-6: Panel Discussion